AD558KNZ Analog Devices Inc, AD558KNZ Datasheet - Page 3

• Manufacturer Part Number: AD558KNZ
• Description: IC DAC 8BIT 5-15V IN MONO 16DIP
• Manufacturer: Analog Devices Inc
• Series: DACPORT®r

Specifications of AD558KNZ

• Data Interface: Parallel
• Settling Time: 800ns
• Number Of Bits: 8
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 375mW
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Resolution (bits): 8bit
• Sampling Rate: 1.25MSPS
• Input Channel Type: Parallel
• Supply Current: 15mA
• Digital Ic Case Style: DIP
• No. Of Pins: 16
• Number Of Channels: 1
• Resolution: 8b
• Conversion Rate: 1.25MSPS
• Interface Type: Parallel
• Single Supply Voltage (typ): 5/9/12/15V
• Dual Supply Voltage (typ): Not RequiredV
• Architecture: R-2R
• Power Supply Requirement: Single
• Output Type: Voltage
• Integral Nonlinearity Error: ±0.25+/- LSB
• Single Supply Voltage (min): 4.5V
• Single Supply Voltage (max): 16.5V
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 16
• Package Type: PDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

REV. A
ABSOLUTE MAXIMUM RATINGS*
V
Digital Inputs (Pins 1–10) . . . . . . . . . . . . . . . . . . 0 V to +7.0 V
V
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Storage Temperature Range
Lead Temperature (soldering, 10 sec) . . . . . . . . . . . . . +300 C
Thermal Resistance
*Stresses greater than those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in the
operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
CC
OUT
N/P (Plastic) Packages . . . . . . . . . . . . . . . . –25 C to +100 C
D (Ceramic) Package . . . . . . . . . . . . . . . . . –55 C to +150 C
Junction to Ambient/Junction to Case
to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V to +18 V
D (Ceramic) Package . . . . . . . . . . . . . . 100 C/W/30 C/W
N/P (Plastic) Packages . . . . . . . . . . . . . 140 C/W/55 C/W
. . . . . . . . . . . . . . . . . . . . . . . Indefinite Short to Ground
Figure 1a. AD558 Pin Configuration (DIP)
AD558 METALIZATION PHOTOGRAPH
Dimensions shown in inches and (mm).
Model
AD558JN
AD558JP
AD558JD
AD558KN
AD558KP
AD558KD
AD558SD
AD558TD
NOTES
1
2
For details on grade and package offerings screened in accordance with MIL-STD-883, refer to the Analog Devices
D = Ceramic DIP; N = Plastic DIP; P = Plastic Leaded Chip Carrier.
Military Products Databook or current AD558/883B data sheet.
1
Temperature
0 C to +70 C
0 C to +70 C
0 C to +70 C
0 C to +70 C
0 C to +70 C
0 C to +70 C
–55 C to +125 C
–55 C to +125 C
Momentary Short to V
ORDERING GUIDE
Relative Accuracy
Error Max
T
1/2 LSB
1/2 LSB
1/2 LSB
1/4 LSB
3/8 LSB
MIN
1/4 LSB
1/4 LSB
3/4 LSB
CC
–3–
to T
MAX
Figure 1b. AD558 Pin Configuration (PLCC and LCC)
Figure 1a. AD558 Pin Configuration (DIP)
Full-Scale
Error, Max
T
DB2
DB3
DB4
DB5
(LSB) DB0
(MSB) DB7
NC
2.5 LSB
2.5 LSB
2.5 LSB
1 LSB
1 LSB
1 LSB
2.5 LSB
1 LSB
MIN
4
5
7
8
6
DB1
DB2
DB3
DB4
DB5
DB6
to T
(Not to Scale)
9 10 11 12 13
1
2
3
4
5
6
8
3
MAX
7
TOP VIEW
AD558
(Not to Scale)
2
TOP VIEW
AD558
1
20 19
Package
Option
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
Plastic (N-16)
PLCC (P-20A)
TO-116 (D-16)
TO-116 (D-16)
TO-116 (D-16)
NC = NO CONNECT
16
15
14
13
12
11
10
18
17
16
15
14
9
2
V
V
V
GND
GND
+V
CS
CE
V
GND
NC
GND
+V
OUT
OUT
OUT
OUT
CC
CC
SENSE
SELECT
SELECT
AD558