353293-9 TE Connectivity, 353293-9 Datasheet - Page 9

• Manufacturer Part Number: 353293-9
• Description: WIRE-BOARD CONN, RECEPTACLE, 9POS, 1.5MM
• Manufacturer: TE Connectivity
• Series: Mini CTr

Specifications of 353293-9

• Connector Type: Wire To Board
• Contact Termination: IDC / IDT
• Gender: Receptacle
• No. Of Contacts: 9
• No. Of Rows: 1
• Pitch Spacing: 1.5mm
• Contact Plating: Tin
• Rohs Compliant: Yes
• Product Type: Receptacles / Sockets - Housings
• Contact Gender: Socket (Female)
• Pitch: 1.5 mm
• Number Of Positions / Contacts: 9
• Number Of Rows: 1
• Termination Style: Crimp
• Contact Material: Phosphor Bronze
• Termination Method To Wire/cable: IDC
• Sealed: No
• Ul File Number: E28476
• Csa File Number: LR 7189-133
• Contact - Rated Current (a): 2
• Operating Voltage Reference: AC/DC, AC, DC
• Operating Voltage (vac): 50
• Operating Voltage (vdc): 50
• Wire/cable Size (awg): 26 – 28
• Profile Height (y-axis) (mm [in]): 6.00 [0.236]
• Number Of Positions: 9
• Centerline (mm [in]): 1.50 [0.059]
• Mating Retention: With
• Length (x-axis) (mm [in]): 15.00 [0.591]
• Width (z-axis) (mm [in]): 3.60 [0.141]
• Contact Type: Socket
• Contact Plating, Mating Area, Material: Pre-Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.2 [7.87]
• Contact Design: Dual Beam
• Mating Alignment: With
• Housing Color: Gray
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Not relevant for lead free process
• Rohs/elv Compliance History: Always was RoHS compliant
• Agency/standard: UL, CSA
• Operating Temperature (°c [°f]): -30 – +105 [-22 – +221]
• Applies To: Wire/Cable
• Accepts Wire Insulation Diameter, Range (mm [in]): 0.80 – 0.95 [0.030 – 0.037]
• Application Use: Wire-to-Board, Wire-to-Board / Wire-to-Wire / Wire-to-Panel, Wire-to-Panel, Wire-to-Wire
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Bag, Box
• Lead Free Status / Rohs Status: Details

ASHL-0005- ES REV B
4. Product Qualification Test Sequence
Examination of Product
Termination Resistance
(Low Level)
Dielectric withstanding Voltage
Insulation Resistance
Temperature Rising
Tensile Strength of Wire Termination
Post Retention Force
Contact Retention Force
Panel Mounting Force
Panel Retention Force
Connector Mating/Unmating Force
Durability
(Repeated Mate/Unmating)
Vibration (Low Frequency)
Physical Shock
Hammering Shocks
Solderability
Resistance to Soldering Heat
Thermal Shock
Humidity (Steady State)
Humidity-Temperature Cycling
Salt Spray
Temperature Life (Heat Aging)
Resistance to Cold
Industrial SO
Industrial H
Industrial Ammonia Gas
Resistance to Solvent
(a) Numbers indicate sequence in which the tests are performed.
Test Examination
2
S Gas
2
Gas
AMP Shanghai Ltd.
Tyco Electronics
1,6 1,3 1,3 1,3 1,3 1,3 1,3 1,3 1,5 1,5 1,5 1,5 1,5 1,5 1,5 1,5
2,5
1
3
4
2
2
Fig.3 (To be continued)
3
2
9 of 17
PAGE
2
4
5
2
Document No.
6
2
Test Sequence (a)
108-5525
Test Group
2
7
2
8
2,4 2,4 2,4 2,4 2,4 2,4 2,4 2,4
3
9 10 11 12 13 14 15 16
3
3
3
3
REV
A
3
3
LOC
3
ES