2008839-1 TE Connectivity, 2008839-1 Datasheet - Page 4
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2008839-1
Manufacturer Part Number
2008839-1
Description
WIRE-BOARD CONNECTOR RECEPTACLE 1POS 4MM
Manufacturer
TE Connectivity
Series
Poke-Inr
Specifications of 2008839-1
Connector Type
Wire To Board
Contact Termination
Right Angle Through Hole
Gender
Receptacle
No. Of Contacts
1
Pitch Spacing
4mm
Contact Plating
Tin
Rohs Compliant
Yes
Make First / Break Last
No
Sealed
No
Termination Method To Pc Board
Through Hole
Pcb Mount Retention
Without
Pcb Mount Alignment
Without
Smt Compatible
No
Mount Angle
Right Angle
Wire/cable Type
Discrete Wire
Termination Method To Wire/cable
Poke-in
Ul File Number
E28476
Keyed
No
Contact Current Rating, Max (a)
4
Operating Voltage (vac)
250
Operating Voltage (vdc)
250
Wire/cable Size (awg)
18 – 22
Tool-less Wire Termination
Yes
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
3.90 [0.154]
Number Of Positions
1
Number Of Rows
1
Length (x-axis) (mm [in])
10.50 [0.413]
Width (z-axis) (mm [in])
3.95 [0.156]
Post-mating Assembly Measurement (mm [in])
10.5 [0.413]
Mating Retention
Without
Header Mating Direction
Horizontal
Preloaded
Yes
Tail Plating Material
Matte Tin over Nickel
Tail Plating, Thickness (µm [?in])
3 [118.11]
Contact Type
Socket
Contact Plating, Mating Area, Material
Matte Tin
Contact Plating, Mating Area, Thickness (µm [?in])
3 [118]
Stamped And Formed
Yes
Connector Style
Receptacle
Mating Alignment
Without
Housing Color
Natural
Ul Flammability Rating
UL 94V-0
Pre-designed Cables Available
No
Agency/standard
CSA, UL
Agency/standard Number
C22.2 No. 182.3-M1987, UL 1977
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Circuit Identification Feature
Without
Operating Temperature (°c [°f])
-40 – +105 [-40 – +221]
Applies To
Printed Circuit Board, Wire/Cable
Uv Exposure Rated
No
Glow Wire Rating
No
Pcb Thickness, Recommended (mm [in])
1.57 [0.062]
Accepts Wire Insulation Diameter, Range (mm [in])
2.10 [0.0826]
Lighting Interconnect Level
Level 2
Application Use
Wire-to-Board
Packaging Method
SMT Pocket Tape
3.6.
Rev B
Product Qualification and Requalification Test Sequence
NOTE
Initial examination of product
LLCR
Withstanding voltage
Surface mount solderability
Resistance to reflow soldering heat
Random vibration
Mechanical shock
Wire insertion force
Wire retention force
Thermal shock
Humidity/temperature cycling
Temperature life
Final examination of product
(a)
(b)
Test or Examination
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Figure 2
3,6
1
1
4
5
2
7
8
2,4
2
1
3
5
Test Sequence (b)
Test Group (a)
2,4
3
1
3
5
2,5
4
1
3
4
6
5
1
2
3
6
1
2
3
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