5-1734592-0 TE Connectivity, 5-1734592-0 Datasheet
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5-1734592-0
Specifications of 5-1734592-0
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5-1734592-0 Summary of contents
Page 1
... C. Contact:Copper Alloy, Tin Plating or Gold Plating over Nickel under-plating. D. Hold Down:Copper Alloy, Tin Plating over Nickel under-plating. RATINGS 3.3. A. Voltage: 250 VAC B. Current: 0.5 A Max C. Temperature °C to 125 °C DR Scott Chien ©2007 Tyco Electronics Corporation * Trademark Taipei, Taiwan │ Indicates change All International Rights Reserved ...
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... TEST REQUIREMENTS AND PROCEDURES SUMMARY 3.5. Test Item Meets requirements of product 1 Examination of Product drawing. No physical damage. 35mΩ. Max. 2 Contact Resistance Insulation Resistance 100M Ohm Min.(Initial) 50M Ohm Min. ( Final) 3 Dielectric No creeping discharge or Withstanding flashover shall occur. 4 Resistance Current leakage:0.5mA MAX ...
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... Within one hour after exposure MIL-STD-202F,Method 103B. Subject mated connectors to 35±2℃ and 5±1% salt(NaCl) for 48hrs. After test, rinse the sample with water and recondition the room temperature for 48hrs. MIL-STD-202F,Method 101D.1. condition B. ...
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... NOTE: (a)Numbers indicate sequence in which tests are performed. (b)Discontinuities shall not take place in this test group, during tests. Rev B Test Group Test Sequence (a) 1,9 1,9 1,9 1,7 1,3 2,6 2.6 2,6 2,6 3,7 3,7 3,7 3,5 4,8 4,8 4 Figure 2 108-57523 1,6 1,3 1,3 1,5 2,5 2 ...