2058703-3 TE Connectivity, 2058703-3 Datasheet - Page 3

• Manufacturer Part Number: 2058703-3
• Description: BOARD-BOARD CONN, RECEPTACLE, 6WAY, 1ROW
• Manufacturer: TE Connectivity
• Series: Hermaphroditicr

Specifications of 2058703-3

• Pitch Spacing: 4mm
• No. Of Rows: 1
• No. Of Contacts: 6
• Gender: Receptacle
• Contact Termination: Surface Mount Horizontal
• Contact Plating: Tin
• Contact Material: Copper Alloy
• Rohs Compliant: Yes
• Product Type: Connector
• Connector Type: Housing
• Sealed: No
• Termination Method To Pc Board: Surface Mount
• Pcb Mount Retention: With
• Pcb Mount Alignment: Without
• Smt Compatible: Yes
• Mount Angle: Right Angle
• Ul File Number: E28476
• Keyed: No
• Make First / Break Last: No
• Mating Retention Type: Latching
• Contact Current Rating, Max (a): 5
• Operating Voltage (vac): 90
• Operating Voltage (vdc): 90
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 4.13 [0.163]
• Centerline (mm [in]): 4.00 [0.157]
• Number Of Positions: 6
• Number Of Rows: 1
• Length (x-axis) (mm [in]): 12.25 [0.482]
• Width (z-axis) (mm [in]): 23.90 [0.940]
• Post-mating Assembly Measurement (mm [in]): 7.5 [0.295]
• Mating Retention: With
• Header Mating Direction: Horizontal
• Pcb Mount Retention Type: Solder Pads
• Tail Plating Material: Matte Tin-Lead over Nickel
• Tail Plating, Thickness (µm [?in]): 5 [191.85]
• Contact Type: Blade/Socket
• Contact Plating, Mating Area, Material: Matte Tin
• Contact Plating, Mating Area, Thickness (µm [?in]): 5 [196.85]
• Stamped And Formed: Yes
• Connector Style: Hermaphroditic
• Mating Alignment: With
• Housing Material: Liquid Crystal Polymer (LCP)
• Housing Color: White
• Ul Flammability Rating: UL 94V-0
• Agency/standard: CSA, UL
• Agency/standard Number: C22.2 No. 182.3-M1987, UL 1977
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Circuit Identification Feature: Without
• Operating Temperature (°c [°f]): -40 – +105 [-40 – +221]
• Applies To: Printed Circuit Board
• Lighting Interconnect Level: Level 2
• Smt Soldering Temperature (°c [°f]): 260 [500]
• Glow Wire Rating: No
• Uv Exposure Rated: No
• Application Use: Board-to-Board
• Packaging Method: Tape & Reel

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Random vibration.
Mechanical shock.
Durability.
Mating force.
Unmating force.
Thermal shock.
Humidity/temperature cycling.
Temperature life.
Rev B
NOTE
Test Description
Shall meet visual requirements, show no physical damage, and meet requirements of additional
tests as specified in the Product Qualification and Requalification Test Sequence shown in Figure
2.
No discontinuities of 1 microsecond
or longer duration.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
See Note.
See Figure 5.
See Figure 5.
See Note.
See Note.
See Note.
ENVIRONMENTAL
Figure 1 (end)
Requirement
EIA-364-28, Test Condition VII,
Condition Letter D.
Subject mated specimens to 3.10
G's rms between 20 to 500 Hz.
Fifteen minutes in each of 3
mutually perpendicular planes.
See Figure 4.
EIA-364-27, Condition H.
Subject mated specimens to 30 G's
half-sine shock pulses of 11
milliseconds duration. Three shocks
in each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
EIA-364-9.
Manually mate and unmate
specimens for 10 cycles.
EIA-364-13.
Measure force necessary to mate
specimens at a maximum rate of
12.7 mm [.5 in] per minute.
EIA-364-13.
Measure force necessary to unmate
specimens at a maximum rate of
12.7 mm [.5 in] per minute.
EIA-364-32, Test Condition VII.
Subject unmated specimens to 25
cycles between -40 and 105°C with
30 minute dwells at temperature
extremes and 1 minute transition
between temperatures.
EIA-364-31, Method III.
Subject mated and unmated
specimens to 10 cycles (10 days)
between 25 and 65°C at 80 to 100%
RH.
EIA-364-17, Method A, Test
Condition 4.
Subject mated specimens to 105°C
for 548 hours.
Procedure
108-2342
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