1-175217-2 TE Connectivity, 1-175217-2 Datasheet - Page 6

CONTACT, RECEPTACLE, 24-20AWG, CRIMP

1-175217-2

Manufacturer Part Number
1-175217-2
Description
CONTACT, RECEPTACLE, 24-20AWG, CRIMP
Manufacturer
TE Connectivity
Series
Dynamic D-3000r
Datasheets

Specifications of 1-175217-2

Connector Type
Contact, Crimp
Contact Plating
Gold
Contact Material
Copper Alloy
Contact Termination
Crimp
Voltage Ac
250V
Rohs Compliant
Yes
Contact Gender
Socket
Product Type
Contact
Product Series
D-3
Insulation Diameter (mm [in])
1.20-2.60 [.047-.102]
Insertion Force
High
Termination End Plating
Gold over Nickel
Wire Range (mm [awg])
0.20-0.60² [24-20]
Contact Type
Socket
Contact Plating, Mating Area, Material
Gold (15)
Contact Base Material
Copper Alloy
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Not relevant for lead free process
Rohs/elv Compliance History
Always was RoHS compliant
Wire Range Mark
M
Applies To
Wire/Cable
Packaging Quantity
1,000
Packaging Method
Bag
For Use With
D-3 Series Dynamic Connectors

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
1-175217-2
Manufacturer:
TE
Quantity:
47 659
Part Number:
1-175217-2
Manufacturer:
AMP
Quantity:
30 000
3.5.12 耐久性
3.5.12 Durability
3.5.13 ハウジング ・ ロック強度
3.5.13 Housing Locking Strength
3.5.14 はんだ付け性
3.5.14 Solderability
Rev. J5
Para.
項目
Test Items
試験項目
試験後、総合抵抗(ローレベル)
の条件に合致すること。
Termination Resistance
(Low Level).
シリーズ名
D-3100S
D-3200S
D-3230
D-3100D
D-3200D
D-3400
D-3500
Series
D-3100S
D-3200S
D-3230
D-3100D
D-3200D
D-3400
D-3500
試験面は新鮮なはんだ面が、95
% 以上であること。
Wet Solder Coverage :
95 % Min.
Product Specification
Requirements
Fig.3 (続く)
Fig.3 (CONT.)
製品規格
ロック強度
Strength
N(min)
N 以上
39.2
39.2
147
147
196
147
147
196
98
98
98
98
98
98
毎分 100mmの割合で、コネクタ・アセンブ
リを下記のサイクルで挿入・引抜を繰り返
す。
EIA364-9
100回 : 錫めっき
500回 : 金めっき
Repeat Insertion/extruction of
connector assembly following times at
100mm/min.operation speed.
EIA364-9
100 times : Tin-Plating
500 times : Gold-Plating
ハウジングのロック強度を測定
EIA364-98
Measure Housing locking strength.
EIA364-98
はんだ温度 : 235 ± 5 °C
はんだ浸漬時間 : 5 ± 0.5 s.
EIA364-52
MIL-STD-202 試験法208
Solder Temperature : 235±5℃
Immersion Duration : 5 ± 0.5 s.
EIA364-52
MIL-STD-202 Method 208
Procedures
108-5349
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