AD768ARZ Analog Devices Inc, AD768ARZ Datasheet - Page 4

• Manufacturer Part Number: AD768ARZ
• Description: IC DAC 16BIT 30MSPS 28-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD768ARZ

• Data Interface: Parallel
• Settling Time: 25ns
• Number Of Bits: 16
• Number Of Converters: 1
• Voltage Supply Source: Dual ±
• Power Dissipation (max): 600mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-SOIC (7.5mm Width)
• Resolution (bits): 16bit
• Sampling Rate: 30MSPS
• Input Channel Type: Parallel
• Supply Current: 63mA
• Digital Ic Case Style: SOIC
• No. Of Pins: 20
• Supply Voltage Range - Analog: ± 4.75V To ± 5.25V
• Rohs Compliant: Yes
• Number Of Channels: 1
• Resolution: 16b
• Interface Type: Parallel
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): ±5V
• Architecture: R-2R/Current Steering
• Power Supply Requirement: Dual
• Output Type: Current
• Integral Nonlinearity Error: ±8LSB
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): ±4.75V
• Dual Supply Voltage (max): ±5.25V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 28
• Package Type: SOIC W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

AD768
WAFER TEST LIMITS
Parameter
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Reference Voltage
Positive Supply Current
Negative Supply Current
Power Dissipation
NOTES
1
2
3
4
Pin No.
1
2
3
4
5
6
7
8–14
15
16
17–23
24
25
26
27
28
Type: AI = Analog Input; DI = Digital Input; AO = Analog Output; P = Power.
Electrical test are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal
yield loss, yield after packaging is not guaranteed for standard product dice.
Limits extrapolated from testing of individual bit errors.
Die offers latch control pad. Edge triggered latches become level triggered when latch control and clock pads are high.
Die substrate is connected to V
Symbol
IOUTA
NR
REFOUT
NC
REFCOM
IREFIN
DB0
DB1–DB7
DCOM
CLOCK
DB8–DB14
DB15
V
V
IOUTB
LADCOM
DD
EE
(LSB) DB0
REFCOM
REFOUT
PIN CONFIGURATION
IREFIN
IOUTA
2
DB1
DB2
DB3
DB4
DB5
DB6
DB7
NR
NC
2
EE.
10
11
12
13
14
1
2
3
4
5
6
7
8
9
NC = NO CONNECT
(Not to Scale)
TOP VIEW
1
AD768
Type
AO
AI
AO
NC
P
AI
DI
DI
P
DI
DI
DI
P
P
AO
P
(T
A
= +25 C, V
28
27
26
25
24
23
22
21
20
19
18
17
16
15
AD768ACHIPS Limit
40
73
600
LADCOM
IOUTB
V
V
DB15 (MSB)
DB14
DB13
DB12
DB11
DB10
DB9
DB8
CLOCK
DCOM
8
6
0.2
1.0
1.0
EE
DD
(–5V)
(+5V)
DAC Current Output. Full-scale current when all data bits are 1s.
Reference Output Voltage. Nominal value is 2.5 V.
Reference Input Current. Nominal is 5 mA. DAC full-scale is 4 this current.
Data Bits 1–7.
Clock Input. Data latched on positive edge of clock.
Data Bits 8–14.
Complementary DAC Current Output. Full-scale current when all data bits are 0s.
DAC Ladder Common.
Name and Function
Noise Reduction Node. Add capacitor for noise reduction.
No Connect. Reserved for internal use.
Reference Ground.
Data Bit 0 (LSB).
Digital Ground.
Data Bit 15 (MSB).
Positive Supply Voltage. Nominal is +5 V.
Negative Supply Voltage. Nominal is –5 V.
DD
= +5.0 V, V
PIN DESCRIPTIONS
EE
= –5.0 V, I
LADCOM
–4–
REFOUT
IOUTB
IOUTA
V
V
NR
NC
EE
EE
REFCOM IREFIN
REFIN
Units
LSB max
LSB max
% FSR max
% FSR max
% of nom. 2.5 V max
mA max
mA max
mW max
Die Size:
0.1106
(2.81
V
= 5 mA, unless otherwise noted)
DD
V
DD
3.60 mm, 10.116 sq. mm)
DICE CHARACTERISTICS
0.1417 inch, 15,672 sq. mils
DB15
DB0
DB14 DB13
DB1
DB2
DB12 DB11
DB3 DB4
3, 4
DB10
DB9
DB8
CLOCK
LATCH CONTROL
DCOM
DB7
DB6
DB5
REV. B