AD5530BRUZ Analog Devices Inc, AD5530BRUZ Datasheet - Page 6

• Manufacturer Part Number: AD5530BRUZ
• Description: IC DAC 12BIT SRL IN/VOUT 16TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD5530BRUZ

• Data Interface: Serial
• Settling Time: 20µs
• Number Of Bits: 12
• Number Of Converters: 1
• Voltage Supply Source: Analog and Digital
• Power Dissipation (max): 60mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP
• Resolution (bits): 12bit
• Sampling Rate: 50kSPS
• Input Channel Type: Serial
• Supply Voltage Range - Analogue: ± 10.8V To ± 13.2V, ± 13.5V To ± 16.5V
• Supply Current: 2mA
• Package: 16TSSOP
• Resolution: 12 Bit
• Conversion Rate: 50 KSPS
• Architecture: R-2R
• Digital Interface Type: Serial (3-Wire, SPI, QSPI, Microwire)
• Number Of Outputs Per Chip: 1
• Output Type: Voltage
• Full Scale Error: ±2 LSB
• Integral Nonlinearity Error: ±1 LSB
• Maximum Settling Time: 20(Typ) us
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD5530/AD5531
ABSOLUTE MAXIMUM RATINGS
(T
V
V
Digital Inputs to GND . . . . . . . . . . . . . –0.3 V to V
SDO to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
REFIN to REFAGND . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
REFIN to GND . . . . . . . . . . . . . . . . V
REFAGND to GND . . . . . . . . . . . . . V
DUTGND to GND . . . . . . . . . . . . . . V
Operating Temperature Range
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD5530/AD5531 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
DD
SS
A
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
= 25°C unless otherwise noted)
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V, –17 V
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
Model
AD5530BRU –40°C to +85 °C
AD5531BRU –40°C to +85 °C
RU = Thin Shrink Small Outline Package.
Temperature Range
SS
SS
SS
– 0.3 V, V
– 0.3 V, V
– 0.3 V, V
REFAGND
Resolution
12
14
DD
DD
DD
DD
PIN CONFIGURATION
REFIN
RBEN
LDAC
SYNC
SCLK
SDIN
SDO
+0.3 V
+0.3 V
+0.3 V
+0.3 V
ORDERING GUIDE
NC = NO CONNECT
1
2
3
4
5
6
7
8
(Not to Scale)
AD5530/
AD5531
TOP VIEW
INL (LSBs)
± 1
± 2
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature (T
Package Power Dissipation . . . . . . . . . . . . . . (T
Thermal Impedance θ
Lead Temperature (Soldering 10s) . . . . . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature (< 20 sec) . . . . . . . . . . . . 235°C
Stresses above those listed under Absolute Maximum Ratings may cause permanent
damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TSSOP (RU-16) . . . . . . . . . . . . . . . . . . . . . . . . 150.4°C/W
16
15
14
13
12
11
10
9
V
V
DUTGND
V
NC
GND
PD
CLR
DD
OUT
SS
DNL(LSBs)
± 1
± 1
JA
WARNING!
Package Option
RU-16
RU-16
J MAX
) . . . . . . . . . . 150°C
ESD SENSITIVE DEVICE
J MAX
– T
A
)/θ
JA