X9251TS24 Intersil, X9251TS24 Datasheet - Page 19
![IC DCP QUAD 100K 256TP 24SOIC](/photos/6/67/66725/x9251ts24_sml.jpg)
X9251TS24
Manufacturer Part Number
X9251TS24
Description
IC DCP QUAD 100K 256TP 24SOIC
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9251US24.pdf
(20 pages)
Specifications of X9251TS24
Taps
256
Resistance (ohms)
100K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
SPI, 3-Wire Serial
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (7.5mm Width)
Resistance In Ohms
100K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
X9251TS24
Manufacturer:
Intersil
Quantity:
43
Company:
Part Number:
X9251TS24-2.7
Manufacturer:
XICOR
Quantity:
316
Company:
Part Number:
X9251TS24Z-2.7
Manufacturer:
Intersil
Quantity:
500
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
19
H
A1
0.10(0.004)
0.25(0.010)
α
M
L
h x 45°
B
M
C
X9251
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AD ISSUE C)
0.0926
0.0040
0.013
0.0091
0.5985
0.2914
0.394
0.010
0.016
MIN
0°
0.05 BSC
INCHES
24
0.1043
0.0118
0.020
0.0125
0.6141
0.2992
0.419
0.029
0.050
MAX
8°
15.20
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MILLIMETERS
MIN
0°
1.27 BSC
24
15.60
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8°
Rev. 1 4/06
April 13, 2007
NOTES
FN8166.5
9
3
4
5
6
7
-
-
-
-
-
-