X9241AWVZ Intersil, X9241AWVZ Datasheet - Page 14
![IC XDCP QUAD 4X10K EE 20-TSSOP](/photos/28/16/281692/20-tssop_mdp_sml.jpg)
X9241AWVZ
Manufacturer Part Number
X9241AWVZ
Description
IC XDCP QUAD 4X10K EE 20-TSSOP
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9241AUP.pdf
(16 pages)
Specifications of X9241AWVZ
Taps
64
Resistance (ohms)
10K
Number Of Circuits
4
Temperature Coefficient
30 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Resistance In Ohms
10K, 10K, 10K, 10K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
X9241AWVZ
Manufacturer:
Intersil
Quantity:
301
Thin Shrink Small Outline Package Family (TSSOP)
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
N
1
C A B
A1
SEE DETAIL “X”
TOP VIEW
b
DETAIL X
SIDE VIEW
D
END VIEW
14
L1
(N/2)+1
L
(N/2)
0.10
M
0° - 8°
0.05
PIN #1 I.D.
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
X9241A
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
14 LD 16 LD 20 LD 24 LD 28 LD
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
MILLIMETERS
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
TOLERANCE
+0.05/-0.06
+0.05/-0.06
Reference
August 31, 2007
Rev. F 2/07
±0.05
±0.05
±0.10
±0.10
±0.15
Basic
Basic
Max
FN8164.6