MCP4131-503E/MF Microchip Technology, MCP4131-503E/MF Datasheet
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MCP4131-503E/MF
Specifications of MCP4131-503E/MF
Related parts for MCP4131-503E/MF
MCP4131-503E/MF Summary of contents
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... Device Operation • Wide Bandwidth (-3 dB) Operation MHz (typ.) for 5.0 kΩ device • Extended temperature range (-40°C to +125°C) © 2007 Microchip Technology Inc. Description The MCP41XX and MCP42XX devices offer a wide range of product offerings using an SPI interface. This family of devices support 7-bit and 8-bit resistor networks, and Potentiometer and Rheostat pinouts ...
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... MCP413X/415X/423X/425X Device Block Diagram SCK SDI SDO NC SHDN For Dual Potentiometer Devices Only Memory (4x9) Wiper0 Wiper1 TCON STATUS Device Features Wiper Device Configuration (3) (1) MCP4131 1 Potentiometer (3) MCP4132 1 Rheostat (1) MCP4141 1 Potentiometer MCP4142 1 Rheostat (3) (1) MCP4151 1 Potentiometer (3) MCP4152 1 Rheostat (1) MCP4161 1 Potentiometer MCP4162 1 ...
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... I Pdis = © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied ...
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... V < IHH DD 4.5V RAM retention voltage (V ) < V RAM BOR Serial Interface Active 5.5V SCK @ 5 MHz write all ’s to volatile Wiper 0 (address 0h) Serial Interface Inactive 5. Serial Interface Active 5.5V IHH SCK @ 5 MHz, decrement volatile Wiper 0 (address 0h) © 2007 Microchip Technology Inc. ...
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... The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and then tested. 9: POR/BOR is not rate dependent. 10: Supply current is independent of current through the resistor network. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X –40°C ≤ +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. DD ...
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... MCP4XX1 devices only 7-bit (Note 2) 5 kΩ 8-bit Code = 80h 7-bit Code = 40h 10 kΩ 8-bit Code = 80h 7-bit Code = 40h 50 kΩ 8-bit Code = 80h 7-bit Code = 40h 100 kΩ 8-bit Code = 80h 7-bit Code = 40h © 2007 Microchip Technology Inc. ...
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... The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and then tested. 9: POR/BOR is not rate dependent. 10: Supply current is independent of current through the resistor network. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X –40°C ≤ +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. DD ...
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... W 3.0V (Note 7) 1.8V 7-bit 5.5V µA W 3.0V (Note 7) 1.8V 100 kΩ 8-bit 5.5V µA W 3.0V (Note 7) 1.8V 7-bit 5.5V µA W 3.0V (Note 7) 1. MHz, Code = Full-Scale f =1 MHz, Code = Full-Scale f =1 MHz, Code = Full-Scale © 2007 Microchip Technology Inc. ...
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... The MCP4XX1 is externally connected to match the configurations of the MCP41X2 and MCP42X2, and then tested. 9: POR/BOR is not rate dependent. 10: Supply current is independent of current through the resistor network. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X –40°C ≤ +2.7V to 5.5V, 5 kΩ, 10 kΩ, 50 kΩ, 100 kΩ devices. DD ...
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... and and V . WZSE WFSE ), which changes significantly over voltage and W ≤ +125°C (extended 5.5V +25° Conditions 8-bit V = 2.7V to 5.5V 2.7V, Code = 80h A 7-bit V = 2.7V to 5.5V 2.7V, Code = 40h A © 2007 Microchip Technology Inc. ...
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... SDO data output valid after SCK↓ edge 83 CS Inactive (V ) after SCK↑ edge IH 84 Hold time of CS Inactive ( Active ( IHH Note 1: This specification by design. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X V IHH MSb BIT6 - - - - - -1 75, 76 BIT6 - - - -1 74 Symbol Min F — SCK — ...
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... Max Units Conditions 10 MHz V = 2. MHz V = 1.8V to 2.7V DD — ns — 2.7V to 5.5V DD — 1.8V to 2.7V DD — 2.7V to 5.5V DD — 1.8V to 2.7V DD — ns — Note 2.7V to 5.5V DD 170 1. — 2. 1.8V to 2.7V DD — ns © 2007 Microchip Technology Inc. ...
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... This table is for the devices where the SPI’s SDI and SDO pins are multiplexed (SDI/SDO) and a Read command is issued. This is NOT required for SDI/SDO operation with the Increment, Decrement, or Write commands. This data rate can be increased by having external pull-up resistors to increase the rising edges of each bit. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X Symbol Min ...
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... JA θ — 68.5 — °C/W JA θ — 82 — °C/W JA θ — 202 — °C/W JA θ — 70 — °C/W JA θ — 85 — °C/W JA θ — N/A — °C/W JA θ — 50 — °C GND. SS Conditions © 2007 Microchip Technology Inc. ...
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... SCK (V = 2.7V and 5.5V). DD 3.0 2.5 5.5V 2.0 1.5 1.0 2.7V 0.5 0.0 - Ambient Temperature (°C) FIGURE 2-2: Device Current ( ( vs. Ambient Temperature © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V 250 200 150 100 50 0 10.00 12. vs. SPI FIGURE 2-3: DD Resistance (R Voltage ( ...
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... Rw 85C Rw 125C Rw -40C INL 25C INL 85C INL 125C INL -40C DNL 25C DNL 85C DNL 125C DNL 98 INL DNL 128 192 256 Wiper Setting (decimal) ) with respect to device W Ω Ω Rheo Mode – 1.8V). DD © 2007 Microchip Technology Inc. ...
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... Ambient Temperature (°C) Ω FIGURE 2-11 – Nominal Resistance Ω vs. Ambient Temperature and V © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V 6000 5000 4000 2.7V 3000 2000 1000 0 80 120 0 FIGURE 2-12: . Setting and Ambient Temperature. ...
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... FIGURE 2-15 – Power-Up Wiper Response Time (20 ms/Div). DS22060A-page FIGURE 2-16: = 5.5V) Increment Wiper Settling Time ( µs/Div). FIGURE 2-17: = 2.7V) Increment Wiper Settling Time ( µs/Div). Ω – Low-Voltage = 5.5V) DD Ω – Low-Voltage = 2.7V) DD © 2007 Microchip Technology Inc. ...
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... W voltage and wiper setting value. Ω FIGURE 2-20 Pot Mode – R INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (V = 1.8V). DD © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V 0.3 120 125C Rw 125C INL 0.2 125C DNL 100 ...
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... Ambient Temperature and V DS22060A-page 12000 10000 8000 6000 4000 2000 0 80 120 0 FIGURE 2-25: . Setting and Ambient Temperature. DD -40°C 25°C 85°C 125° 128 160 192 224 256 Wiper Setting (decimal) Ω Ω – vs. Wiper WB © 2007 Microchip Technology Inc. ...
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... A Ω FIGURE 2-26 – Low-Voltage Decrement Wiper Settling Time (V (1 µs/Div). Ω FIGURE 2-27 – Low-Voltage Decrement Wiper Settling Time (V (1 µs/Div). © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V FIGURE 2-28: = 5.5V) Increment Wiper Settling Time ( µs/Div). FIGURE 2-29: = 2.7V) Increment Wiper Settling Time ( µ ...
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... DNL 25C DNL 85C DNL 125C DNL 63.5 RW 58.5 53.5 INL 48.5 43.5 38.5 33.5 28.5 23.5 18.5 13.5 DNL 8.5 3.5 -1.5 Wiper Setting (decimal) ) with respect to device W Ω Ω Rheo Mode – 1.8V). DD © 2007 Microchip Technology Inc ...
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... Ambient Temperature (°C) Ω FIGURE 2-36 – Nominal Resistance Ω vs. Ambient Temperature and V © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V 60000 50000 40000 30000 20000 10000 0 80 120 0 FIGURE 2-37: . Setting and Ambient Temperature. ...
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... FIGURE 2-39 – Low-Voltage Decrement Wiper Settling Time (V (1 µs/Div). DS22060A-page FIGURE 2-40: = 5.5V) Increment Wiper Settling Time ( µs/Div). FIGURE 2-41: = 2.7V) Increment Wiper Settling Time ( µs/Div). Ω – Low-Voltage = 5.5V) DD Ω – Low-Voltage = 2.7V) DD © 2007 Microchip Technology Inc. ...
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... W voltage and wiper setting value. Ω FIGURE 2-44: 100 k Pot Mode – R INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (V = 1.8V). DD © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V 0.2 120 125C Rw 125C INL 125C DNL 100 ...
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... Ambient Temperature and DS22060A-page 120000 100000 80000 60000 40000 20000 0 80 120 0 FIGURE 2-49: Setting and Ambient Temperature. -40°C 25°C 85°C 125° 128 160 192 224 256 Wiper Setting (decimal) Ω Ω 100 k – vs. Wiper WB © 2007 Microchip Technology Inc. ...
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... FIGURE 2-50: 100 k – Low-Voltage Decrement Wiper Settling Time (V (1 µs/Div). Ω FIGURE 2-51: 100 k – Low-Voltage Decrement Wiper Settling Time (V (1 µs/Div). © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V FIGURE 2-52: = 5.5V) Increment Wiper Settling Time ( µs/Div). FIGURE 2-53: = 2.7V) Response Time (1 µ ...
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... FIGURE 2-57: Resistor Network and Temperature. DD 5.5V 3. 120 Temperature (°C) Resistor Network 0 to Ω ( Mismatch vs. AB 5.5V 3. 110 Temperature (°C) Resistor Network 0 to Ω (100 k ) Mismatch vs. AB © 2007 Microchip Technology Inc. ...
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... SCK, CS, and IH SHDN) vs. V and Temperature. DD 1.4 1.3 5.5V 1.2 1.1 1 0.9 0.8 2.7V 0.7 0.6 - Temperature (°C) FIGURE 2-59: V (SDI, SCK, CS, and IL SHDN) vs. V and Temperature. DD © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X = 5V 0V -10 -15 -20 -25 -30 -35 -40 -45 80 120 -40 FIGURE 2-60: Temperature ...
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... Temperature. 15.0 14.5 14.0 2.7V 13.5 13.0 12.5 12.0 - Temperature (°C) FIGURE 2-63: SCK Input Frequency vs. Voltage and Temperature. DS22060A-page 30 2.1 Test Circuits 5. 2.7V Offset GND 80 120 FIGURE 2-64: DD Test. 5.5V 80 120 + OUT Gain vs. Frequency © 2007 Microchip Technology Inc. ...
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... The DFN and QFN packages have a contact on the bottom of the package. This contact is conductively connected to the die substrate, and therefore should be unconnected or connected to the same ground as the device’s V pin. SS © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X Table 3-1. Weak Pull-up/ Buffer ...
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... DD The input power supply is relative to V While the device V performance of the device may not meet the data sheet . specifications. DD 3.11 No Connection Those pins should be either connected and < V (2.7V), the electrical DD min © 2007 Microchip Technology Inc. ...
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... BOR • Volatile wiper register is loaded with the default wiper value • The TCON register is loaded it’s default value • The device is capable of digital operation © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 4.1.2 BROWN-OUT RESET When the device powers down, the device V ...
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... The STATUS register is placed at Address 05h. Register 4-1 R-1 R-0 R-x RESV RESV U = Unimplemented bit, read as ‘0’ ‘0’ = Bit is cleared x = Bit is unknown Figure R-x R-x R-x RESV SHDN RESV bit 0 5-2). While the device is in Hard- © 2007 Microchip Technology Inc. ...
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... TCON register will control the state of the terminals. The SHDN pin does not modify the state of the TCON bits. 2: These bits do not affect the wiper register values. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X The value that is written to this register will appear on the resistor network terminals when the serial com- mand has completed ...
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... The hardware SHDN pin (when active) overrides the state of these bits. When the SHDN pin returns to the inactive state, the TCON register will control the state of the terminals. The SHDN pin does not modify the state of the TCON bits. 2: These bits do not affect the wiper register values. DS22060A-page 36 (CONTINUED) © 2007 Microchip Technology Inc. ...
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... INL) for the smaller resistance devices compared to larger resistance devices (100.0 kΩ). FIGURE 5-1: Resistor Block Diagram. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 5.1 Resistor Ladder Module The resistor ladder is a series of equal value resistors (R ) with a connection point (tap) between the two S resistors ...
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... Table 5-2 shows the DEFAULT FACTORY SETTINGS SELECTION Wiper Code 8-bit 7-bit Mid-scale 80h 40h Mid-scale 80h 40h Mid-scale 80h 40h Mid-scale 80h 40h © 2007 Microchip Technology Inc. ...
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... The TCON register bits return to controlling the terminal connection state A B FIGURE 5-2: Hardware Shutdown Resistor Network Configuration. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 5.3.2 TERMINAL CONTROL REGISTER (TCON) The Terminal Control (TCON) register is a volatile register used to configure the connection of each ...
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... MCP413X/415X/423X/425X NOTES: DS22060A-page 40 © 2007 Microchip Technology Inc. ...
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... Note 1: If High voltage commands are desired, some type of external circuitry needs to be implemented. FIGURE 6-1: Typical SPI Interface Block Diagram. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X Typical SPI Interfaces are shown in SPI interface, The Master’s Output pin is connected to the Slave’s Input pin and the Master’s Input pin is connected to the Slave’ ...
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... For any other command, the SDI/SDO pin returns to an input. SDI/SDO Open Drain FIGURE 6-2: Serial I/O Mux Block Diagram. © 2007 Microchip Technology Inc. “smart” pull-up SDI Control SDO Logic ...
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... SDI/SDO 250 kHz (1) Note 1: MCP41X1 devices only. 2: This is the maximum clock frequency without an external pull-up resistor. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 6.1.5 THE CS SIGNAL The Chip Select (CS) signal is used to select the device and frame a command sequence. To start a command, or sequence of commands, the CS signal must ...
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... SPI Figure 6-3 and Figure 6-4 are Figure 6-5 and Figure 6-6 Figure 6-7 are increment and decrement bit4 bit3 bit2 bit1 bit0 bit4 bit3 bit2 bit1 bit0 bit3 bit2 bit1 bit0 bit3 bit2 bit1 bit0 © 2007 Microchip Technology Inc. ...
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... Note 1: The SDI pin will read the state of the SDI pin which will be the SDO signal, unless overdriven supported for compability with the MCP414X/6X and MCP424X/6X devices high voltage IHH operation. FIGURE 6-6: 16-Bit Read Command for Devices with SDI/SDO multiplexed - SPI Waveform (Mode 0,0). © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X CMDERR bit ...
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... AD2 AD1 AD0 C1 CMDERR bit “1” = “Valid” Command/Address “0” = “Invalid” Command/Address bit2 bit1 bit0 X X bit0 CMDERR bit “1” = “Valid” Command/Address “0” = “Invalid” Command/Address bit2 bit1 bit0 bit0 © 2007 Microchip Technology Inc. ...
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... Bits Address Command Bits FIGURE 7-1: General SPI Command Formats. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 7.1 Command Byte The Command Byte has three fields, the Address, the Command, and 2 Data bits, see only one of the data bits is defined (D8). This is for the Write command ...
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... Microchip Technology Inc. (2) MISO (SDO pin) 1111 1111 1111 1111 1111 111n nnnn nnnn 1111 1111 1111 1111 1111 1111 1111 1111 ...
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... All following SDO bits will be low until the CMDERR condition is cleared by forcing the CS pin to the inactive state ( © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 7.3.1 ABORTING A TRANSMISSION All SPI transmissions must have the correct number of SCK pulses to be executed. The command is not executed until the complete number of clocks have been received ...
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... This reduces the probability of noise on the SCK pin corrupting the desired SPI command string Bits 16-Bits 16-Bits 8-Bits 8-Bits 16-Bits 16-Bits 8-Bits 8-Bits © 2007 Microchip Technology Inc. High Voltage ( IHH pin? — — — — Yes Yes Yes ...
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... Note Error Condition occurs (CMDERR = L), all following SDO bits will be low until the CMDERR condition is cleared (the CS pin is forced to the inactive state). FIGURE 7-2: Write Command - SDI and SDO States. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 7.5.1 SINGLE WRITE The write operation requires that the CS pin be in the ...
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... The writes do not need the same volatile memory address. COMMAND BYTE SDI SDO Note Command Error (CMDERR) occurs at this bit location (*), then all following SDO bits will be driven low until the CS pin is driven inactive (V FIGURE 7-3: Continuous Write Sequence. DS22060A-page 52 DATA BYTE © 2007 Microchip Technology Inc. ...
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... D SDO FIGURE 7-4: Read Command - SDI and SDO States. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 7.6.1 SINGLE READ The read operation requires that the CS pin be in the active state (V IL the inactive state ( The 16-bit Read Command (Command IL IHH Byte and Data Byte) is then clocked in on the SCK and SDI pins ...
Page 54
... Note Command Error (CMDERR) occurs at this bit location (*), then all following SDO bits will be driven low until the CS pin is driven inactive (V FIGURE 7-5: Continuous Read Sequence. DS22060A-page 54 Figure 7-5 shows the sequence for three continuous reads. The reads do not need the same memory address. DATA BYTE © 2007 Microchip Technology Inc. ...
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... SDO bits will be driven low until the CS pin is driven inactive ( FIGURE 7-6: Increment Command - SDI and SDO States. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 7.7.1 SINGLE INCREMENT Typically, the CS pin starts at the inactive state (V but may be already be in the active state due to the Wiper completion of another command ...
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... Driving the CS pin to V should occur as soon as possible (within device specifications) after the last desired increment occurs. COMMAND BYTE (INCR COMMAND (n+2) ) (INCR COMMAND (n+ ensure that IH IH COMMAND BYTE Note Note Note Note 3, 4 © 2007 Microchip Technology Inc. ...
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... SDO bits will be driven low until the CS pin is driven inactive (V IH FIGURE 7-8: Decrement Command - SDI and SDO States. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 7.8.1 SINGLE DECREMENT Typically the CS pin starts at the inactive state (V may be already be in the active state due to the com- pletion of another command ...
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... Driving the CS pin to V should occur as soon as possible (within device specifications) after the last desired decrement occurs. COMMAND BYTE (DECR COMMAND (n-1) ) (DECR COMMAND (n- ensure that IH IH COMMAND BYTE Note Note Note Note 3, 4 © 2007 Microchip Technology Inc. ...
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... MCP4XXX specifica- tions. So this PIC MCU operating at 3.3V will drive 2.64V, and for the MCP4XXX operating at 5.5V, OH the V is 2.47V. Therefore, the interface signals meet IH specifications. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 5V Voltage Regulator PIC MCU SDI CS SCK ...
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... R to the Common A. The Common A and Common B connections could be connected to V Input Input Balance FIGURE 8-5: using Terminal Disconnects MCP4XXX MCP4XXX Non-Volatile rheo- BW rheostat value AW and Common base W of Transistor (or Amplifier) B Common B Bias Example Application Circuit © 2007 Microchip Technology Inc. ...
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... FIGURE 8-6: Typical Microcontroller Connections. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 8.4.2 LAYOUT CONSIDERATIONS Inductively-coupled AC transients and digital switching noise can degrade the input and output signal integrity, potentially masking the MCP4XXX’s performance. Careful board layout minimizes these effects and increases the Signal-to-Noise Ratio (SNR) ...
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... MCP413X/415X/423X/425X NOTES: DS22060A-page 62 © 2007 Microchip Technology Inc. ...
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... AN219 Comparing Digital Potentiometers to Mechanical Potentiometers — Digital Potentiometer Design Guide — Signal Chain Design Guide © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X 9.2 Technical Documentation Several additional technical documents are available to assist you in your design and development. These technical documents include Application Notes, Tech- nical Briefs, and Design Guides ...
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... MCP413X/415X/423X/425X NOTES: DS22060A-page 64 © 2007 Microchip Technology Inc. ...
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... PACKAGING INFORMATION 10.1 Package Marking Information 8-Lead DFN (3x3) Part Number MCP4131-502E/MF XXXX MCP4131-103E/MF XYWW NNN MCP4131-104E/MF MCP4131-503E/MF MCP4151-502E/MF MCP4151-103E/MF MCP4151-104E/MF MCP4151-503E/MF 8-Lead MSOP Part Number MCP4131-502E/MS XXXXXX MCP4131-103E/MS YWWNNN MCP4131-104E/MS MCP4131-503E/MS MCP4151-502E/MS MCP4151-103E/MS MCP4151-104E/MS MCP4151-503E/MS 8-Lead PDIP XXXXXXXX XXXXXNNN ...
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... MCP4252-502E/MS 425252 423213 MCP4252-103E/MS 425213 423214 MCP4252-104E/MS 425214 423253 MCP4252-503E/MS 425253 Example MCP4251 502E/P^^ 0733256 Example MCP4251 502E/SL^^ Example 4251502E Example 4251 502 E/ML^^ 0733256 © 2007 Microchip Technology Inc. : Example BAEH 0733 256 Example 423252 733256 0733256 0733 256 e 3 ...
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... Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X b EXPOSED PAD E ...
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... A2 0.75 0.85 A1 0.00 – E 4.90 BSC E1 3.00 BSC D 3.00 BSC L 0.40 0.60 L1 0.95 REF φ 0° – c 0.08 – b 0.22 – Microchip Technology Drawing C04-111B φ L MAX 1.10 0.95 0.15 0.80 8° 0.23 0.40 © 2007 Microchip Technology Inc. ...
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... Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X E1 3 ...
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... NOM MAX 8 1.27 BSC – 1.75 – – – 0.25 6.00 BSC 3.90 BSC 4.90 BSC – 0.50 – 1.27 1.04 REF – 8° – 0.25 – 0.51 – 15° – 15° Microchip Technology Drawing C04-057B © 2007 Microchip Technology Inc. ...
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... Package may have one or more exposed tie bars at ends. 3. Package is saw singulated. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X ...
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... A2 0.75 0.85 A1 0.00 – E 4.90 BSC E1 3.00 BSC D 3.00 BSC L 0.40 0.60 L1 0.95 REF φ 0° – c 0.08 – b 0.15 – Microchip Technology Drawing C04-021B φ MAX 1.10 0.95 0.15 0.80 8° 0.23 0.33 © 2007 Microchip Technology Inc. ...
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... Significant Characteristic. 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X E1 D ...
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... REF φ 0° c 0.17 b 0.31 α 5° β 5° h α c β MAX 14 – 1.75 – – – 0.25 – 0.50 – 1.27 – 8° – 0.25 – 0.51 – 15° – 15° Microchip Technology Drawing C04-065B © 2007 Microchip Technology Inc. ...
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... Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side. 3. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X E E1 ...
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... Dimension Limits MIN 0. 2.50 b 0.25 L 0. NOM MAX 16 0.65 BSC 0.90 1.00 0.02 0.05 0.20 REF 4.00 BSC 2.65 2.80 4.00 BSC 2.65 2.80 0.30 0.35 0.40 0.50 – – Microchip Technology Drawing C04-127B © 2007 Microchip Technology Inc. ...
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... APPENDIX A: REVISION HISTORY Revision A (September 2007) • Original Release of this Document. © 2007 Microchip Technology Inc. MCP413X/415X/423X/425X APPENDIX B: MIGRATING FROM THE MCP41XXX AND MCP42XXX DEVICES This is intended to give an overview of some of the differences to be aware of when migrating from the MCP41XXX and MCP42XXX devices. ...
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... MCP413X/415X/423X/425X NOTES: DS22060A-page 78 © 2007 Microchip Technology Inc. ...
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... XX . MCP4131-502E/XX: 5 kΩ, 8LD Device MCP4131T-502E/XX: T/R, 5 kΩ, 8LD Device MCP4131-103E/XX: 10 kΩ, 8-LD Device MCP4131T-103E/XX: T/R, 10 kΩ, 8LD Device MCP4131-503E/XX: 50 kΩ, 8LD Device MCP4131T-503E/XX: T/R, 50 kΩ, 8LD Device MCP4131-104E/XX: 100 kΩ, 8LD Device MCP4131T-104E/XX: T/R, 100 kΩ, 8LD Device MCP4132-502E/XX: 5 kΩ ...
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... MCP413X/415X/423X/425X NOTES: DS22060A-page 80 © 2007 Microchip Technology Inc. ...
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... PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 © 2007 Microchip Technology Inc. EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 ...