GQM1885C2A2R2BB01D Murata, GQM1885C2A2R2BB01D Datasheet - Page 24

CAPACITOR, NP0, 0603, 2.2PF

GQM1885C2A2R2BB01D

Manufacturer Part Number
GQM1885C2A2R2BB01D
Description
CAPACITOR, NP0, 0603, 2.2PF
Manufacturer
Murata
Series
GQMr
Datasheet

Specifications of GQM1885C2A2R2BB01D

Capacitance
2.2pF
Capacitance Tolerance
± 0.1pF
Voltage Rating
100VDC
Capacitor Dielectric Type
Ceramic Multi-Layer
Capacitor Case Style
0603
No. Of Pins
2
Lead Spacing
0.5mm
Operating Temperature
RoHS Compliant
Operating Temperature Range
-55°C To +125°C
Svhc
No SVHC (15-Dec-2010)
Rohs Compliant
Yes
Tolerance
0.1 pF
Temperature Coefficient / Code
C0G (NP0)
Package / Case
0603 (1608 metric)
Product
Low ESR MLCCs
Dimensions
0.8 mm W x 1.6 mm L x 0.8 mm H
Termination Style
SMD/SMT
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
GQM1885C2A2R2BB01D
Manufacturer:
MURATA
Quantity:
640 000
!Note
ï This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, itís specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
ï This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
C-29-C
Application Specific Capacitors
High Frequency Ceramic Capacitors – GQM Series
GQM Soldering and Mounting
!Note
■ !Caution (Soldering and Mounting)
1. Mounting Position
2. Chip Placing
Choose a mounting position that minimizes the stress
An excessively low bottom dead point of the suction
Dirt particles and dust accumulated between the suction
imposed on the chip during flexing or bending of the
board.
nozzle imposes great force on the chip during mounting,
causing cracked chips. So adjust the suction nozzle's
bottom dead point by correcting warp in the board.
Normally, the suction nozzle's bottom dead point must be
set on the upper surface of the board. Nozzle pressure
for chip mounting must be a 1 to 3N static load.
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes great force on the chip
during mounting, causing cracked chips. And the locating
claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction
nozzle and the locating claw must be maintained,
checked and replaced periodically.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Caution
(Soldering and Mounting)
w
w
w
w
w
.
w
m
.
u
m
r
u
a
r
t
a
a
t
Component Direction
Chip Mounting Close to Board Separation Point
Incorrect
Correct
.
a
c
.
o
c
Perforation
Suction Nozzle
m
o
Board
A
m
Slit
B
Support Pin
D
C
Deflection
Continued on the following page.
Innovator in Electronics – 43
Chip arrangement
Worst A-C-(B~D) Best
!Caution
Locate chip
horizontal to the
direction in
which stress
acts
Board Guide
C02E.pdf
83
07.2.6
13

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