MCP4231-103E/P Microchip Technology, MCP4231-103E/P Datasheet - Page 70
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MCP4231-103E/P
Manufacturer Part Number
MCP4231-103E/P
Description
IC DGTL POT 10K 2CH 14DIP
Manufacturer
Microchip Technology
Specifications of MCP4231-103E/P
Package / Case
14-DIP (0.300", 7.62mm)
Taps
129
Resistance (ohms)
10K
Number Of Circuits
2
Temperature Coefficient
150 ppm/°C Typical
Memory Type
Volatile
Interface
SPI Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Resistance In Ohms
10K
Number Of Pots
Dual
Taps Per Pot
128
Resistance
10 KOhms
Wiper Memory
Volatile
Digital Interface
Serial (SPI)
Operating Supply Voltage
2.5 V or 3.3 V or 5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
Through Hole
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.8 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
MCP4231-103-E/P
MCP4231-103-E/P
MCP4231-103-E/P
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MCP4231-103E/P
Manufacturer:
Microchip
Quantity:
293
MCP413X/415X/423X/425X
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS22060A-page 70
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
NOTE 1
A
A1
§
N
1
2
D
b
3
e
Dimension Limits
A2
E1
E
Units
A2
A1
E1
φ
L1
N
A
E
D
α
e
h
L
φ
c
b
β
1.25
0.10
0.25
0.40
0.17
0.31
MIN
0°
5°
5°
h
L
L1
–
MILLIMETERS
h
1.27 BSC
6.00 BSC
3.90 BSC
4.90 BSC
1.04 REF
NOM
8
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-057B
α
β
© 2007 Microchip Technology Inc.
MAX
1.75
0.25
0.50
1.27
0.25
0.51
15°
15°
8°
–
c