MCP4021T-202E/MC Microchip Technology, MCP4021T-202E/MC Datasheet - Page 56

• Manufacturer Part Number: MCP4021T-202E/MC
• Description: IC DGTL POT 2.1K 1CH 8DFN
• Manufacturer: Microchip Technology

Specifications of MCP4021T-202E/MC

• Package / Case: 8-DFN
• Taps: 64
• Resistance (ohms): 2.1K
• Number Of Circuits: 1
• Temperature Coefficient: 150 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: Up/Down
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Resistance In Ohms: 2.10K
• Number Of Pots: Single
• Taps Per Pot: 64
• Resistance: 2.1 KOhms
• Wiper Memory: Non Volatile
• Digital Interface: Serial (2-Wire)
• Operating Supply Voltage: 3.3 V, 5 V
• Supply Current: 45 uA
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.7 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MCP4XXXDM-DB - BOARD DAUGHTER DIGIPOT MCP4XXXMCP402XEV - BOARD EVAL FOR MCP402X
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: MCP4021T-202E/MCTR

MCP4021/2/3/4
8-Lead Plastic Dual-Flat No-Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated
DS21945E-page 56
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
A3
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. § Significant Characteristic
4. Package is saw singulated
5. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
N
1
TOP VIEW
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length §
Contact-to-Exposed Pad §
2
D
A1
Dimension Limits
E
A
NOTE 2
EXPOSED PAD
Microchip Technology Drawing No. C04–123, Sept. 8, 2006
Units
A1
A3
D2
E2
N
A
D
E
K
e
b
L
L
K
MIN
0.80
0.00
1.30
1.50
0.18
0.30
0.20
MILLIMETERS
BOTTOM VIEW
b
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
0.90
0.02
0.25
0.40
—
—
—
8
D2
2
e
© 2006 Microchip Technology Inc.
MAX
1.00
0.05
1.75
1.90
0.30
0.50
1
—
N
E2
NOTE 1