X9258US24 Intersil, X9258US24 Datasheet - Page 19

• Manufacturer Part Number: X9258US24
• Description: IC DCP QUAD 50K 256TP 24SOIC
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9258US24

• Taps: 256
• Resistance (ohms): 50K
• Number Of Circuits: 4
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Resistance In Ohms: 50K
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Thin Shrink Small Outline Package Family (TSSOP)
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
N
1
C A B
A1
SEE DETAIL “X”
TOP VIEW
b
DETAIL X
SIDE VIEW
D
END VIEW
19
L1
(N/2)+1
L
(N/2)
0.10
M
0° - 8°
0.05
PIN #1 I.D.
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
X9258
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
14 LD 16 LD 20 LD 24 LD 28 LD
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
MILLIMETERS
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
TOLERANCE
+0.05/-0.06
+0.05/-0.06
Reference
Rev. F 2/07
±0.05
±0.05
±0.10
±0.10
±0.15
April 14, 2011
Basic
Basic
Max
FN8168.5