AD9060JZ Analog Devices Inc, AD9060JZ Datasheet - Page 4

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AD9060JZ

Manufacturer Part Number
AD9060JZ
Description
IC ADC 10BIT 75MSPS 68-CLCC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD9060JZ

Number Of Bits
10
Sampling Rate (per Second)
75M
Data Interface
Parallel
Number Of Converters
1
Power Dissipation (max)
3.5W
Voltage Supply Source
Dual ±
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
68-CLCC

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AD9060
EXPLANATION OF TEST LEVELS
Test Level
I.
II.
III. Sample tested only.
IV. Parameter is guaranteed by design and characterization
V.
VI. All devices are 100% production tested at 25°C. 100%
ABSOLUTE MAXIMUM RATINGS
+V
–V
A
+V
+V
ENCODE, ENCODE . . . . . . . . . . . . . . . . . . . . . . . 0 V to –V
3/4
Digital Output Current . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature
Storage Temperature . . . . . . . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature
Lead Soldering Temp (10 sec) . . . . . . . . . . . . . . . . . . . . 300°C
NOTES
1
2
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD9060 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Absolute maximum ratings are limiting values to be applied individually and
beyond which the serviceability of the circuit may be impaired. Functional
operability is not necessarily implied. Exposure to absolute maximum rating
conditions for an extended period of time may affect device reliability.
Typical thermal impedances (part soldered onto board): 68 -lead ceramic chip
carrier: θ
500 LFM).
IN
AD9060JZ/AD9060KZ . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
S
S
REF
REF
REF
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –2 V to +2 V
100% production tested.
100% production tested at 25°C and sample tested at
specified temperatures.
testing.
Parameter is a typical value only.
production tested at temperature extremes for extended
temperature devices; sample tested at temperature extremes
for commercial/industrial devices.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–6 V
, –V
, 1/2
to –V
JC
REF
= 1°C/W; θ
REF
REF
, 3/4
, 1/4
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4.0 V
REF
REF
JA
, 1/2
= 17°C/W (no air flow); θ
Current . . . . . . . . . . . . . . . . . . . ± 10 mA
Model
AD9060JZ
AD9060KZ
AD9060/PCB
REF
, 1/4
REF
2
. . . . . . . . . . . . . . . . . 150°C
1
. . . . . . . . . –2 V to +2 V
Temperature Range
0°C to 70°C
0°C to 70°C
0°C to 70°C
JA
= 15°C/W (air flow =
ORDERING GUIDE
S
–4–
Package Description
Leaded Chip Carrier
Leaded Chip Carrier
Evaluation Board
MECHANICAL INFORMATION (DIE LAYOUT)
Die Dimensions . . . . . . . . . 206 mils × 140 mils × 15 (± 2) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . 4 mils × 4 mils
Metallization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –V
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Nitride
DIE LAYOUT
ENCODE
ENCODE
(LSB) D
+V
NC = NO CONNECT
+V
SENSE
GND
GND
GND
–V
+V
REF
D
D
D
D
S
0
S
4
3
2
1
Package Options
Z-68D
Z-68D
GND
D
D
D
D
D
OVERFLOW
GND
GND
–V
NC
–V
–V
LSB INVERT
5
6
7
8
9
S
REF
SENSE
REV. B
S

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