AD9236BRU-80 Analog Devices Inc, AD9236BRU-80 Datasheet - Page 34

• Manufacturer Part Number: AD9236BRU-80
• Description: IC ADC 12BIT 80MSPS 3V 28-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD9236BRU-80

• Rohs Status: RoHS non-compliant
• Number Of Bits: 12
• Sampling Rate (per Second): 80M
• Number Of Converters: 2
• Power Dissipation (max): 366mW
• Voltage Supply Source: Analog and Digital
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TSSOP (0.173", 4.40mm Width)
• For Use With: AD9236BCP-80EB - BOARD EVAL FOR AD9236-80AD9236BRU-80EB - BOARD EVAL FOR AD9236-80 TSSOP

AD9236
ORDERING GUIDE
Model
AD9236BRU-80
AD9236BRURL7-80
AD9236BRUZ-80
AD9236BRUZRL7-80
AD9236BCP-80
AD9236BCPRL7-80
AD9236BCPZ-80
AD9236BCPZRL7-80
AD9236BRU-80EB
AD9236BCP-80EB
1
2
Z = Pb-free part.
It is recommended that the exposed paddle be soldered to the ground plane for the LFCSP. There is an increased reliability of the solder joints, and the maximum
thermal capability of the package is achieved with the exposed paddle soldered to the customer board.
2
1, 2
1
2
2
1, 2
1
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
28-Lead Thin Shrink Small Outline Package (TSSOP)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
32-Lead Lead Frame Chip Scale (LFCSP_VQ)
TSSOP Evaluation Board
LFCSP Evaluation Board
Rev. B | Page 34 of 36
Package Option
RU-28
RU-28
RU-28
RU-28
CP-32-2
CP-32-2
CP-32-2
CP-32-2