532903-3 TE Connectivity, 532903-3 Datasheet

532903-3

Manufacturer Part Number

532903-3

Description

HDI RECP ASSY 4 ROW 128 POS

Manufacturer

TE Connectivity

Series

AMP-HDI Seriesr

Datasheets

1.1-532428-1.pdf (6 pages)

2.1-532903-1.pdf (2 pages)

Specifications of 532903-3

Product Type

Receptacles

Number Of Rows

Number Of Positions / Contacts

Pitch

2.54 mm

Mounting Style

Through Hole

Termination Style

Solder

Contact Plating

Gold

Gender

Receptacle

Pcb Mount Style

Through Hole

Pcb Mounting Orientation

Right Angle

Make First / Break Last

Pcb Mount Retention

Without

Termination Post Length (mm [in])

3.05 [0.120]

Solder Tail Contact Plating

Tin

Number Of Positions

128

Centerline (mm [in])

2.54 [0.100]

Contact Configuration

Four-Beam

Contact Plating, Mating Area, Material

Gold (30)

Contact Base Material

Copper Alloy

Underplate Material

Nickel

Mating Alignment

Without

Housing Material

PPS

Housing Color

Brown

Housing Material Temperature

High

Center Guide

Without

Government/industry Qualification

Rohs/elv Compliance

ELV compliant, 5 of 6 Compliant

Lead Free Solder Processes

Not suitable for lead free processing

Lead Free Status / Rohs Status

Details

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1.1.

1.2.

2.1.

2.2.

3.1.

3.2.

3.3.

a TE Connectivity Ltd. Company

TE logo is a trademark.

SCOPE

Content

This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) high

density interconnect connector. These are box type receptacle and pin 2 piece connectors which

provide a connection m ethod on .100 inch centerline. Connectors are available in 2, 3 and 4 row

configuration.

Qualification

W hen tests are perform ed on subject product line, procedures specified in 109 Series Test

Specifications shall be used unless otherwise specified. All inspections shall be perform ed using

applicable inspection plan and product drawing.

APPLICABLE DOCUM ENTS

The following docum ents form a part of this specification to the extent specified herein. Unless

otherwise specified, latest edition of the docum ent applies. In the event of conflict between

requirem ents of this specification and product drawing, product drawing shall take precedence. In the

event of conflict between requirem ents of this specification and referenced docum ents, this

specification shall take precedence.

TE Docum ents

Military Standard

MIL-STD-275: Printed W iring for Electronic Equipm ent

REQUIREMENTS

Design and Construction

Connectors shall be of design, construction and physical dim ensions specified on applicable product

drawing.

Materials

Ratings

109-1: General Requirem ents for Test Specifications

109 Series: Test Specifications as indicated in Figure 1

501-48: Qualification Test Report

Term inal:

•

Housing: Therm oplastic, glass filled, UL 94V-0

Current: 3 am peres m axim um per contact, 2.25 am peres continuous per contact at room am bient,

with not m ore than 2 adjacent or opposing circuits carrying this current.

Operating Tem perature: -65 to 125°C for gold contacts

Receptacle: Beryllium copper or copper nickel silicon

Pin: Phosphor bronze or brass

| Indicates change

*Trademark

Product

Specification

Connector, Interconnect, High Density

For latest revision, visit our website at www.te.com/documents.

For Regional Customer Service, visit our website at www.te.com

Other products, logos, and company names might be trademarks of their respective owners.

108-9063

11Mar11 Rev C

1 of 6

LOC B

Related parts for 532903-3

532903-3 Summary of contents

Page 1

... SCOPE 1.1. Content This specification covers perform ance, tests and quality requirem ents for TE Connectivity (TE) high density interconnect connector. These are box type receptacle and pin 2 piece connectors which provide a connection m ethod on .100 inch centerline. Connectors are available and 4 row configuration. ...

Page 2

Perform ance and Test Description Connectors shall be designed to m eet electrical, m echanical and environm ental perform ance requirem ents specified in Figure 1. 3.5. Test Requirem ents and Procedures Sum m ary Test Description Exam ination ...

Page 3

Test Description Unm ating force. Contact retention. Contact engaging force. Contact separating force. Durability. Resistance to soldering heat. Insertion force, ACTION PIN. Retention force, ACTION PIN. Torque, ACTION PIN. Therm al shock. Hum idity-tem perature cycling. Rev C Requirem ent ...

Page 4

Connector Tests and Sequences Test or Exam ination Exam ination of product Term ination resistance, specified current Term ination resistance, low level Dielectric withstanding voltage Insulation resistance Vibration Physical shock Mating force Unm ating force Contact retention Contact engaging ...

Page 5

QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Sam ple Selection Connector housings and contacts shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. Test groups 1, 2 and 3 shall ...

Page 6

Term ination Resistance Measurem ent Points Note: (1) Tolerance: ±.005 as applicable, unless otherwise specified. (2) Material: Tool steel (3) Heat Treat: Rockwell C 50-55 (4) Gage Surface: Shall be clean of contam inants or lubricants Rev C Figure 3 ...

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