LTC2208IUP#TRPBF Linear Technology, LTC2208IUP#TRPBF Datasheet - Page 26

• Manufacturer Part Number: LTC2208IUP#TRPBF
• Description: IC ADC 16BIT 130MSPS 64-QFN
• Manufacturer: Linear Technology

Specifications of LTC2208IUP#TRPBF

• Number Of Bits: 16
• Sampling Rate (per Second): 130M
• Data Interface: Parallel
• Number Of Converters: 1
• Power Dissipation (max): 1.78W
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 64-WFQFN, Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LTC2208
as much as possible. In particular, care should be taken
not to run any digital track alongside an analog signal
track or underneath the ADC.
High quality ceramic bypass capacitors should be used
at the V
be located as close to the pins as possible. The traces
APPLICATIONS INFORMATION
Grounding and Bypassing
The LTC2208 requires a printed circuit board with a
clean unbroken ground plane; a multilayer board with an
internal ground plane is recommended. The pinout of the
LTC2208 has been optimized for a fl owthrough layout so
that the interaction between inputs and digital outputs is
minimized. Layout for the printed circuit board should
ensure that digital and analog signal lines are separated
26
DD,
V
CM
, and OV
DD
pins. Bypass capacitors must
connecting the pins and bypass capacitors must be kept
short and should be made as wide as possible.
The LTC2208 differential inputs should run parallel and
close to each other. The input traces should be as short
as possible to minimize capacitance and to minimize
noise pickup.
Heat Transfer
Most of the heat generated by the LTC2208 is transferred
from the die through the bottom-side exposed pad. For
good electrical and thermal performance, the exposed
pad must be soldered to a large grounded pad on the PC
board. It is critical that the exposed pad and all ground
pins are connected to a ground plane of suffi cient area
with as many vias as possible.
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