50935-6 TE Connectivity, 50935-6 Datasheet

50935-6

Manufacturer Part Number

50935-6

Description

SOCKET,MIN-SPR AU-AU SER-1

Manufacturer

TE Connectivity

Datasheet

1.50935-6.pdf (1 pages)

Specifications of 50935-6

Socket Length (mm [in])

4.27 [0.168]

Sleeve Style

Open Bottom

Sealant

Without

Sleeve Material

Copper

Mating Pin Dia. Range (mm [in])

0.33 – 0.51 [0.013 – 0.020]

Sleeve Material Plating

Gold (30)

Spring Material

Beryllium Copper

Contact Spring Plating

Gold Flash

Contact Base Material

Beryllium Copper

Insertion Method

Hand/Semi-Automatic

Government/industry Qualification

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Application

Production

Packaging Method

Loose Piece

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