LTC1407CMSE Linear Technology, LTC1407CMSE Datasheet - Page 23
![IC ADC 12BIT 3MSPS SAMPLE 10MSOP](/photos/6/59/65968/161-10-msop_sml.jpg)
LTC1407CMSE
Manufacturer Part Number
LTC1407CMSE
Description
IC ADC 12BIT 3MSPS SAMPLE 10MSOP
Manufacturer
Linear Technology
Datasheet
1.LTC1407CMSEPBF.pdf
(24 pages)
Specifications of LTC1407CMSE
Number Of Bits
12
Sampling Rate (per Second)
3M
Data Interface
Serial, SPI™
Number Of Converters
1
Power Dissipation (max)
14mW
Voltage Supply Source
Single Supply
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC1407CMSE
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC1407CMSE
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC1407CMSE#PBF
Manufacturer:
LT
Quantity:
214
Part Number:
LTC1407CMSE#PBF
Manufacturer:
LINEAR/凌特
Quantity:
20 000
Company:
Part Number:
LTC1407CMSE#TRPBF
Manufacturer:
LT
Quantity:
4 390
Company:
Part Number:
LTC1407CMSE-1
Manufacturer:
LT
Quantity:
10 000
Part Number:
LTC1407CMSE-1#PBF
Manufacturer:
LT凌特厂
Quantity:
20 000
Company:
Part Number:
LTC1407CMSE-1#TRPBF
Manufacturer:
LT
Quantity:
560
PACKAGE DESCRIPTION
(.0120 .0015)
0.305 0.038
TYP
GAUGE PLANE
(.206)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
5.23
MIN
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
(.007)
RECOMMENDED SOLDER PAD LAYOUT
0.18
(.010)
2.794 0.102
0.254
(.110 .004)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
DETAIL “A”
DETAIL “A”
0 – 6 TYP
(.0197)
2.083 0.102
(.082 .004)
0.50
BSC
10-Lead Plastic MSOP , Exposed Die Pad
(Reference LTC DWG # 05-08-1664 Rev C)
(.021 .006)
0.53 0.152
SEATING
0.889 0.127
(.035 .005)
(.126 – .136)
PLANE
3.20 – 3.45
MSE Package
(.118 .004)
3.00 0.102
(.007 – .011)
(.193 .006)
4.90 0.152
0.17 – 0.27
(NOTE 3)
TYP
(.043)
MAX
1.10
EXPOSED PAD OPTION
BOTTOM VIEW OF
(.0197)
0.50
BSC
10
10
1
1 2 3 4 5
9
8
7 6
DETAIL “B”
LTC1407/LTC1407A
(.081 .004)
2.06 0.102
(.072 .004)
(.118 .004)
1.83 0.102
3.00 0.102
(.0196 .003)
0.497 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 0.0508
MSOP (MSE) 0908 REV C
(.004 .002)
REF
NO MEASUREMENT PURPOSE
THE LEADFRAME FEATURE.
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
DETAIL “B”
0.05 REF
0.29
REF
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