MCP3008-I/SL Microchip Technology, MCP3008-I/SL Datasheet - Page 20

• Manufacturer Part Number: MCP3008-I/SL
• Description: IC ADC 10BIT 2.7V 8CH SPI 16SOIC
• Manufacturer: Microchip Technology

Specifications of MCP3008-I/SL

• Number Of Converters: 1
• Package / Case: 16-SOIC (0.154", 3.90mm Width)
• Number Of Bits: 10
• Sampling Rate (per Second): 200k
• Data Interface: Serial, SPI™
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Architecture: SAR
• Conversion Rate: 200 KSPs
• Resolution: 10 bit
• Input Type: Voltage
• Snr: 200 dB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Package: 16SOIC N
• Sampling Rate: 200 KSPS
• Number Of Adcs: 1
• Number Of Analog Inputs: 8|4
• Digital Interface Type: Serial (4-Wire, SPI)
• Polarity Of Input Voltage: Unipolar
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

MCP3004/3008
6.5
The MCP3004/3008 devices provide both digital and
analog ground connections to provide additional
means of noise reduction. As is shown in Figure 6-5,
the analog and digital circuitry is separated internal to
the device. This reduces noise from the digital portion
of the device being coupled into the analog portion of
the device. The two grounds are connected internally
through the substrate which has a resistance of 5 -10 .
If no ground plane is utilized, both grounds must be
connected to V
available, both digital and analog ground pins should
be connected to the analog ground plane. If both an
analog and a digital ground plane are available, both
the digital and the analog ground pins should be con-
nected to the analog ground plane. Following these
steps will reduce the amount of digital noise from the
rest of the board being coupled into the A/D converter.
FIGURE 6-5:
Ground Pins.
DS21295B-page 20
Digital Side
-SPI Interface
-Shift Register
-Control Logic
Utilizing the Digital and Analog
Ground Pins
SS
DGND
Analog Ground Plane
Separation of Analog and Digital
on the board. If a ground plane is
MCP3004/08
V
Substrate
5 - 10
DD
Analog Side
-Sample Cap
-Capacitor Array
-Comparator
AGND
0.1 µF
2002 Microchip Technology Inc.