3-487952-0 TE Connectivity, 3-487952-0 Datasheet - Page 4
![030 1MM FPC BTM HORZ](/photos/41/49/414926/pr487952_sml.jpg)
3-487952-0
Manufacturer Part Number
3-487952-0
Description
030 1MM FPC BTM HORZ
Manufacturer
TE Connectivity
Specifications of 3-487952-0
Rohs Compliant
NO
Termination Method To Pc Board
Surface Mount
Pcb Mounting Orientation
Right Angle
Pcb Mount Alignment
Without
Pcb Mount Retention
With
Actuator Type
Stuffer
Shrouded
Yes
Sealed
No
Strain Relief
Without
Contact Current Rating, Max (a)
1
Operating Voltage Reference
AC
Operating Voltage (vac)
200
Shielded
No
Tail Orientation
In-line
Profile Height (y-axis) (mm [in])
2.56 [0.1008]
Centerline (mm [in])
1.00 [0.039]
Number Of Positions
30
Selectively Loaded
No
Pcb Mount Retention Type
Solder Pads
Length (x-axis) (mm [in])
37.92 [1.4929]
Width (z-axis) (mm [in])
6.54 [0.2575]
Contact Plating, Mating Area, Material
Tin-Lead
Contact Plating, Mating Area, Thickness (µm [?in])
0.381 [15]
Tail Plating Material
Tin-Lead
Tail Plating, Thickness (µm [?in])
0.381 [15]
Contact Design
Single Beam
Housing Material
Liquid Crystal Polymer (LCP)
Contact Mating Location
Bottom
Flex Cable Thickness (mm [in])
0.3 [0.012]
Housing Color
Ivory
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Circuit Identification Feature
With
Operating Temperature (°c [°f])
-40 – +85 [-40 – +185]
Zif/non-zif
ZIF
Contact Transmits (typical Application)
Signal (Data)
Pick And Place Cover
Without
Packaging Method
Tape & Reel
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
3-487952-0
Manufacturer:
MOLEX
Quantity:
32 278
4.
4.1.
4.2.
4.3.
4.4.
Rev C
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
B.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. When
product failure occurs, corrective action shall be taken and samples resubmitted for qualification.
Testing to confirm corrective action is required before resubmittal.
Quality Conformance Inspection
The applicable quality inspection plan will specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Sample Selection
Samples shall be prepared in accordance with applicable Instruction Sheets and shall be selected
at random from current production. All test groups shall consist of a minimum of 5 connectors.
Test groups 1 and 2 shall be soldered to printed circuit boards. A minimum of 30 contacts from
these test groups shall be randomly selected and tested. If available, test group 1 shall contain
both minimum and maximum size connectors. Test groups 3 and 4 shall consist of a minimum of 5
unmated and unmounted connectors. A minimum of 24 contacts from test group 3 shall be
randomly selected and tested.
Test Sequence
Qualification inspection shall be verified by testing samples as specified in Figure 2.
108-1393
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