DS3231S#T&R Maxim Integrated Products, DS3231S#T&R Datasheet - Page 2

• Manufacturer Part Number: DS3231S#T&R
• Description: IC RTC W/TCXO 16-SOIC
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/TCXO/Crystalr

Specifications of DS3231S#T&R

• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.3 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Memory Size: -

ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
Operating Temperature Range
Junction Temperature ......................................................+125°C
RECOMMENDED OPERATING CONDITIONS
(T
ELECTRICAL CHARACTERISTICS
(V
3.3V, V
Extremely Accurate I
RTC/TCXO/Crystal
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Logic 1 Input SDA, SCL
Logic 0 Input SDA, SCL
Active Supply Current
Standby Supply Current
Temperature Conversion Current
Power-Fail Voltage
Logic 0 Output, 32kHz,
Logic 0 Output,
Output Leakage Current 32kHz,
Input Leakage SCL
V
(V
A
CC
BAT
INT/SQW Relative to Ground.............................-0.3V to +6.0V
(noncondensing) .............................................-40°C to +85°C
CC
= T
/SQW, SDA
/SQW, SDA
_____________________________________________________________________
= 2.3V to 5.5V, V
Pin I/O Leakage
Active)
Leakage Current
BAT
MIN
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
PARAMETER
to T
= 3.0V, and T
MAX
, unless otherwise noted.) (Notes 2, 3)
CC
, V
CC
A
BAT
= Active Supply (see Table 1), T
= +25°C, unless otherwise noted.) (Notes 2, 3)
, 32kHz, SCL, SDA, RST,
I
SYMBOL
SYMBOL
CCSCONV
I
BATLKG
JC
V
I
I
V
V
V
V
V
CCA
CCS
I
V
I
BAT
I
LO
OL
CC
OL
OL
PF
LI
JA
IH
IL
) (Note 1) ......23°C/W
) (Note 1)....73°C/W
(Notes 4, 5)
I
output on, SQW output off
(Note 5)
I
output on, SQW output off
I
I
Output high impedance
2
2
OL
OL
C bus inactive, 32kHz
C bus inactive, 32kHz
= 3mA
= 1mA
high impedance (Note 6)
2
A
= T
C-Integrated
CONDITIONS
CONDITIONS
MIN
Storage Temperature Range ...............................-40°C to +85°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow, 2 times max)
to T
Lead(Pb)-free...............................................................+260°C
Containing lead(Pb) .....................................................+240°C
(See the Handling, PC Board Layout, and Assembly section.)
MAX
, unless otherwise noted.) (Typical values are at V
V
V
V
V
V
V
CC
CC
CC
CC
CC
CC
= 3.63V
= 5.5V
= 3.63V
= 5.5V
= 3.63V
= 5.5V
0.7 x
MIN
V
2.45
-200
-0.3
MIN
2.3
2.3
-1
-1
CC
2.575
TYP
TYP
3.3
3.0
25
0
V
MAX
MAX
0.3 x
2.70
+10
V
200
300
110
170
575
650
100
5.5
5.5
CC
0.3
0.4
0.4
+1
+1
CC
+
UNITS
UNITS
μA
μA
μA
μA
μA
μA
nA
V
V
V
V
V
V
V
CC
=