DS1338U-33 Maxim Integrated Products, DS1338U-33 Datasheet - Page 15
![IC RTC 56BYTE NV RAM 3.3V 8-USOP](/photos/1/39/13936/406-8-msop_sml.jpg)
DS1338U-33
Manufacturer Part Number
DS1338U-33
Description
IC RTC 56BYTE NV RAM 3.3V 8-USOP
Manufacturer
Maxim Integrated Products
Type
Clock/Calendar/NVSRAMr
Datasheet
1.DS1338Z-33.pdf
(16 pages)
Specifications of DS1338U-33
Memory Size
56B
Time Format
HH:MM:SS (12/24 hr)
Date Format
YY-MM-DD-dd
Interface
I²C, 2-Wire Serial
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Dc
0720
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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DS1338U-33
Manufacturer:
MAXIM/美信
Quantity:
20 000
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Part Number:
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Part Number:
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Manufacturer:
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Quantity:
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Part Number:
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Manufacturer:
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Part Number:
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Part Number:
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Manufacturer:
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HANDLING, PCB LAYOUT, AND ASSEMBLY
The DS1338C package contains a quartz tuning-fork crystal. Pick-and-place equipment may be used, but
precautions should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to
prevent damage to the crystal. Exposure to reflow is limited to 2 times maximum.
Avoid running signal traces under the package, unless a ground plane is placed between the package and the
signal line. All N.C. (no connect) pins must be connected to ground.
The leaded 16-SO package may be reflowed as long as the peak temperature does not exceed 240°C. Peak reflow
temperature (≥ 230°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed
40 seconds (30 seconds nominal).
The RoHS and lead-free/RoHS packages may be reflowed using a reflow profile that complies with JEDEC J-STD-
020.
Moisture-sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-
sensitive device (MSD) classifications.
PIN CONFIGURATIONS
CHIP INFORMATION
TRANSISTOR COUNT: 12,231
PROCESS: CMOS
THERMAL INFORMATION
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
TOP VIEW
8 SO
8 μSOP
16 SO
PART
PACKAGE TYPE
GND
8 MAX
V
16 SO
X1
X2
BAT
8 SO
SO, μSOP
THETA-J
1
2
3
4
(°C/W)
170
229
73
8
7
6
5
A
V
SQW/OUT
SCL
SDA
CC
THETA-J
(°C/W)
40
39
23
C
PACKAGE CODE
W16-H2
U8+1
S8+4
15 of 16
TOP VIEW
SQW/OUT
SCL
N.C.
N.C.
N.C.
N.C.
N.C.
V
cc
DS1338 I
SO (300 mils)
DS1338C
DOCUMENT NUMBER
2
C RTC with 56-Byte NV RAM
21-0041
21-0036
21-0042
GND
SDA
N.C.
N.C.
N.C.
N.C.
N.C.
V
BAT