DS1556-70+ Maxim Integrated Products, DS1556-70+ Datasheet - Page 17

• Manufacturer Part Number: DS1556-70+
• Description: IC RTC RAM Y2K 5V 70NS 32-EDIP
• Manufacturer: Maxim Integrated Products
• Type: Clock/Calendar/NVSRAM/Y2Kr

Specifications of DS1556-70+

• Memory Size: 1M (128K x 8)
• Time Format: HH:MM:SS (24 hr)
• Date Format: YY-MM-DD-dd
• Interface: Parallel
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 32-DIP Module (600 mil), 32-EDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AC TEST CONDITIONS
Output Load: 50 pF + 1TTL Gate
Input Pulse Levels:
Timing Measurement Reference Levels:
Input Pulse Rise and Fall Times: 5 ns
NOTES:
1. Voltage referenced to ground.
2. Typical values are at +25C and nominal supplies.
3. Outputs are open.
4. Battery switchover occurs at the lower of either the battery voltage or V
5. The IRQ/FT and RST outputs are open drain.
6. Data-retention time is at +25C.
7. Each DS1556 has a built-in switch that disconnects the lithium source until V
8. RTC modules (DIP) can be successfully processed through conventional wave-soldering techniques
9. t
10. t
11.
PACKAGE INFORMATION
For the latest package outline information and land patterns, go to www.maxim-ic.com/packages.
in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PACKAGE TYPE
user. The expected t
absence of V
as long as temperature exposure to the lithium energy source contained within does not exceed
+85C. Post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic
vibration is not used.
In addition, for the PowerCap:
a. Maxim recommends that PowerCap Module bases experience one pass through solder reflow
b. Hand soldering and touch-up: Do not touch or apply the soldering iron to leads for more than
t
WC
AH1
AH2
34 PWRCP
= 200ns.
Input: 1.5V
Output: 1.5V
oriented with the label side up (“live-bug”).
3 seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove
the part, apply flux, heat the lead frame pad until the solder reflow and use a solder wick to
remove solder.
, t
, t
32 EDIP
DH1
DH2
are measured from WE going high.
are measured from CE going high.
CC
starting from the time power is first applied by the user.
0.0 to 3.0V
DR
is defined for DIP modules and PowerCap modules as a cumulative time in the
PACKAGE CODE
MDF32+1
PC2+6
17 of 18
DS1556 1M, Nonvolatile, Y2K-Compliant Timekeeping RAM
OUTLINE NO.
21-0245
21-0246
PF
.
LAND PATTERN NO.
CC
Note that a “+”, “#”, or “-”
is first applied by the
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