DS12C887A+ Maxim Integrated Products, DS12C887A+ Datasheet - Page 21
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DS12C887A+
Manufacturer Part Number
DS12C887A+
Description
IC RTC W/RAM 128 BYTE 24-EDIP
Manufacturer
Maxim Integrated Products
Type
Clock/Calendar/NVSRAMr
Datasheet
1.DS12885N.pdf
(22 pages)
Specifications of DS12C887A+
Memory Size
113B
Time Format
HH:MM:SS (12/24 hr)
Date Format
YY-MM-DD-dd
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Through Hole
Package / Case
24-DIP (600 mil) Module
Function
Clock/Calendar/Alarm
Rtc Memory Size
113 Byte
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
Through Hole
Rtc Bus Interface
Multiplexed
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
+ Denotes a lead(Pb)-free/RoHS-compliant package.
T&R = Tape and reel.
*A “+” anywhere on the top mark indicates a lead(Pb)-free device, and an “N” indicates an industrial temperature range device.
DS12885+
DS12885N+
DS12885Q+
DS12885QN+
DS12885Q+T&R
DS12885QN+T&R
DS12885S+
DS12885SN+
DS12885S+T&R
DS12885T+
DS12885TN+
DS12887+
DS12887A+
DS12C887+
DS12C887A+
TOP VIEW
N.C.
N.C.
AD0
AD1
AD2
AD3
AD4
AD5
Pin Configurations (continued)
PART
1
2
4
7
3
5
6
8
32
9
10
31
11
30
TQFP
DS12885T
12
29
28
13
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
TEMP RANGE
14
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
0°C to +70°C
27
15
26
____________________________________________________________________
16
25
24 RCLR
23 N.C.
22
21
20
19
18
17
V
IRQ
N.C.
RESET
DS
GND
BAT
PIN-PACKAGE
24 PDIP
24 PDIP
28 PLCC
28 PLCC
28 PLCC
28 PLCC
24 SO (300 mils)
24 SO (300 mils)
24 SO (300 mils)
32 TQFP
32 TQFP
24 EDIP
24 EDIP
24 EDIP
24 EDIP
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages. Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
PROCESS: CMOS
SUBSTRATE CONNECTED TO GROUND
PACKAGE TYPE
PACKAGE
28 PLCC
32 TQFP
24 PDIP
24 EDIP
PLCC
PDIP
24 SO
SO
Real-Time Clocks
THETA-JA (°C/W)
PACKAGE CODE
Package Information
Ordering Information
Thermal Information
MDP24+1
Q28+13
W24+1
C32+3
P24+4
105
75
95
DS12885
DS12885
DS12885Q
DS12885Q
DS12885Q
DS12885Q
DS12885S
DS12885S
DS12885S
DS12885
DS12885
DS12887
DS12887A
DS12C887
DS12C887AA
Chip Information
TOP MARK*
THETA-JC (°C/W)
DOCUMENT NO.
21-0042
21-0044
21-0241
21-0049
21-0292
30
22
25
21