ISL1208IB8Z-TK Intersil, ISL1208IB8Z-TK Datasheet - Page 4

• Manufacturer Part Number: ISL1208IB8Z-TK
• Description: IC RTC LP BATT BACKED SRAM 8SOIC
• Manufacturer: Intersil
• Type: Clock/Calendar/NVSRAMr

Specifications of ISL1208IB8Z-TK

• Memory Size: 2B
• Time Format: HH:MM:SS (12/24 hr)
• Date Format: YY-MM-DD-dd
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ISL1208IB8Z-TKTR

Absolute Maximum Ratings
Voltage on V
Voltage on X1 and X2 Pins
Latchup (Note 4) ................Class II, Level B @ +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
Serial Interface Specifications
DC Operating Characteristics – RTC
Power-Down Timing
SERIAL INTERFACE SPECS
IRQ/F
1. θ
2. For θ
3. The V
4. Jedec Class II pulse conditions and failure criterion used. Level B exceptions are using a negative pulse limited to -0.5V.
SYMBOL
(respect to GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V
(respect to GND) . . . . . . . . . . . . .-0.5V to V
Tech Brief TB379.
Applications section.
V
SYMBOL
SYMBOL
V
V
JA
V
TRIPHYS
BATHYS
IL
V
OUT
V
DD SR-
I
I
I
V
I
V
DD1
DD2
DD3
BAT
I
TRIP
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
BAT
I
LO
DD
OL
LI
JC
DD
, the “case temp” location is the center of the exposed metal pad on the package underside.
DD
and SDA pins should not be subjected to negative voltage while the V
SDA and SCL Input Buffer LOW
Voltage
, V
BAT
Main Power Supply
Battery Supply Voltage
Supply Current
Supply Current With I
Supply Current (Low Power Mode)
Battery Supply Current
Input Leakage Current on SCL
I/O Leakage Current on SDA
V
V
V
Output Low Voltage
V
BAT
TRIP
BAT
DD
, SCL, SDA, and IRQ Pins (Note 3)
PARAMETER
Negative Slewrate
Mode Threshold
Hysteresis
Hysteresis
Temperature = -40°C to +85°C, unless otherwise stated.
PARAMETER
PARAMETER
4
-0.5V to V
2
C Active
Over the recommended operating conditions unless otherwise specified.
BAT
DD
+ 0.5 (V
+ 0.5 (V
Temperature = -40°C to +85°C, unless otherwise stated.
BAT
DD
V
V
V
V
V
V
I
V
I
OL
OL
DD
DD
DD
DD
BAT
DD
DD
Mode)
Mode)
TEST CONDITIONS
= 3mA
= 1mA
= 5V
= 3V
= 5V
= 5V, LPMODE = 1
= 5V
= 2.7V
= 3V
ISL1208
CONDITIONS
CONDITIONS
Thermal Information
Thermal Resistance (Typical, Note 1)
Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
SOIC Package . . . . . . . . . . . . . . . . . . .
MSOP Package . . . . . . . . . . . . . . . . . .
TDFN Package (Note 2). . . . . . . . . . . .
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
BAT
pin is biased, otherwise latchup can result. See the
NOTES
NOTES
5, 6
5, 6
5
5
7
NOTES
(Note 9)
(Note 9)
MIN
MIN
2.7
1.8
1.6
10
15
(Note 9)
MIN
-0.3
(Note 8)
(Note 8)
TYP
TYP
400
100
100
(Note 8)
1.2
1.4
2.2
40
30
50
2
TYP
θ
JA
53.7
128
(°C/W)
95
(Note 9)
(Note 9)
(Note 9)
MAX
MAX
120
950
100
5.5
5.5
2.6
0.4
0.4
75
10
MAX
0.3 x
6
5
V
4
September 12, 2008
DD
θ
JC
UNITS
UNITS
UNITS
V/ms
N/A
N/A
FN8085.8
2.8
(°C/W)
mV
mV
µA
µA
µA
µA
nA
nA
nA
V
V
V
V
V
V