CP82C54-12 Intersil, CP82C54-12 Datasheet - Page 21

IC INTERFACE 5V 12.5MHZ 24-DIP

CP82C54-12

Manufacturer Part Number
CP82C54-12
Description
IC INTERFACE 5V 12.5MHZ 24-DIP
Manufacturer
Intersil
Type
Programmable Timerr
Datasheets

Specifications of CP82C54-12

Frequency
12MHz
Voltage - Supply
4.5 V ~ 5.5 V
Current - Supply
10mA
Operating Temperature
0°C ~ 70°C
Package / Case
24-DIP (0.600", 15.24mm)
Number Of Leads
24
Operating Frequency
12.5 MHz
Package Type
PDIP
Power, Standby
5 V
Technology
CMOS
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Count
-

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CP82C54-12
Manufacturer:
INTERS
Quantity:
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Part Number:
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Manufacturer:
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Quantity:
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Part Number:
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Manufacturer:
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Quantity:
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Part Number:
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Manufacturer:
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Quantity:
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j
E1
x 45
Ceramic Leadless Chip Carrier Packages (CLCC)
B
h x 45
E2
o
-E-
e
-F-
1
A
o
L
0.010
S
L2
E H
S
0.007
D3
D
D1
B1
21
M
-H-
D2
B2
E F
e
S H S
A1
L3
E3
0.010
PLANE 2
PLANE 1
B3
L1
E
S
E F
S
82C54
J28.A
28 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
NOTES:
SYMBOL
1. Metallized castellations shall be connected to plane 1 terminals
2. Unless otherwise specified, a minimum clearance of 0.015 inch
3. Symbol “N” is the maximum number of terminals. Symbols “ND”
4. The required plane 1 terminals and optional plane 2 terminals (if
5. The corner shape (square, notch, radius, etc.) may vary at the
6. Chip carriers shall be constructed of a minimum of two ceramic
7. Dimension “A” controls the overall package thickness. The maxi-
8. Dimensioning and tolerancing per ANSI Y14.5M-1982.
9. Controlling dimension: INCH.
ND
NE
A1
B1
B2
B3
D1
D2
D3
E1
E2
E3
and extend toward plane 2 across at least two layers of ceramic
or completely across all of the ceramic layers to make electrical
connection with the optional plane 2 terminals.
(0.38mm) shall be maintained between all metallized features
(e.g., lid, castellations, terminals, thermal pads, etc.)
and “NE” are the number of terminals along the sides of length
“D” and “E”, respectively.
used) shall be electrically connected.
manufacturer’s option, from that shown on the drawing.
layers.
mum “A” dimension is package height before being solder dipped.
e1
L1
L2
L3
A
B
D
E
N
e
h
L
j
MIL-STD-1835 CQCC1-N28 (C-4)
0.060
0.050
0.022
0.006
0.442
0.442
0.015
0.045
0.045
0.075
0.003
MIN
-
-
-
0.300 BSC
0.150 BSC
0.300 BSC
0.150 BSC
0.050 BSC
0.072 REF
0.040 REF
0.020 REF
INCHES
28
7
7
0.100
0.088
0.028
0.022
0.460
0.460
0.460
0.460
0.055
0.055
0.095
0.015
MAX
-
-
11.23
11.23
1.52
1.27
0.56
0.15
0.38
1.14
1.14
1.90
0.08
MIN
MILLIMETERS
-
-
-
1.83 REF
7.62 BSC
3.81 BSC
7.62 BSC
3.81 BSC
1.27 BSC
1.02 REF
0.51 REF
28
7
7
11.68
11.68
11.68
11.68
2.54
2.23
0.71
0.56
1.40
1.40
2.41
0.038
MAX
-
-
Rev. 0 5/18/94
NOTES
6, 7
2, 4
2
2
2
5
5
3
3
3
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-

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