MC100EP11DG ON Semiconductor, MC100EP11DG Datasheet - Page 2
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MC100EP11DG
Manufacturer Part Number
MC100EP11DG
Description
IC BUFFER FANOUT DIFF 1:2 8SOIC
Manufacturer
ON Semiconductor
Series
100EPr
Type
Fanout Buffer (Distribution)r
Datasheet
1.MC100EP11DTR2G.pdf
(12 pages)
Specifications of MC100EP11DG
Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
ECL, PECL
Output
ECL, PECL
Frequency - Max
3GHz
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Frequency-max
3GHz
Number Of Outputs
4
Max Input Freq
>3000 MHz (Typ)
Propagation Delay (max)
0.27 ns @ 3V to 5.5V
Supply Voltage (max)
- 5.5 V or 5.5 V
Supply Voltage (min)
- 3 V or 3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC100EP11DGOS
Figure 1. 8−Lead Pinout (Top View) and Logic Diagram
Q1
Q0
Q1
Q0
1
2
3
4
Table 2. ATTRIBUTES
1. For additional information, see Application Note AND8003/D.
Internal Input Pulldown Resistor
Internal Input Pullup Resistor
ESD Protection
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Flammability Rating
Transistor Count
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
Characteristics
R
R
R
http://onsemi.com
1
1
2
Oxygen Index: 28 to 34
Charged Device Model
8
7
6
5
Human Body Model
Machine Model
2
V
D
D
V
CC
EE
TSSOP−8
SOIC−8
DFN8
* Pins will default LOW when left open.
** Pins will default to high when left open.
Table 1. PIN DESCRIPTION
Q0, Q0, Q1, Q1
V
EP
PIN
D*, D**
V
EE
CC
Pb Pkg
Level 1
Level 1
Level 1
UL 94 V−0 @ 0.125 in
73 Devices
37.5 kW
> 200 V
> 4 kV
> 2 kV
Value
75 kW
FUNCTION
ECL Data Inputs
ECL Data Outputs
Positive Supply
Negative Supply
(DFN8 only) Thermal
exposed pad must be
connected to a sufficient
thermal conduit. Electrically
connect to the most negative
supply (GND) or leave
unconnected, floating open.
Pb−Free Pkg
Level 1
Level 3
Level 1