NBSG11MN ON Semiconductor, NBSG11MN Datasheet - Page 13

• Manufacturer Part Number: NBSG11MN
• Description: IC DRIVER CLOCK RSECL 1:2 16QFN
• Manufacturer: ON Semiconductor
• Type: Fanout Buffer (Distribution)r

Specifications of NBSG11MN

• Number Of Circuits: 1
• Ratio - Input:output: 1:2
• Differential - Input:output: Yes/Yes
• Input: CML, LVCMOS, LVDS, LVTTL, NECL, RSNECL, PECL
• Output: RSECL, RSPECL, RSNECL
• Frequency - Max: 12GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Frequency-max: 12GHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: NBSG11MNOS

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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16 X
0.10 C
0.05 C
NOTE 5
16X
16X
LOCATION
0.10 C
0.08 C
0.15 C
K
PIN 1
L
0.15 C
NOTE 3
A B
16X
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
Ç Ç Ç Ç
4
1
16
BOTTOM VIEW
SIDE VIEW
TOP VIEW
5
D2
D
e
13
8
(A3)
12
9
EXPOSED PAD
A1
e
A
B
E
N. American Technical Support: 800-282-9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: [phone]
Japan Customer Focus Center
Phone: [phone]
PACKAGE DIMENSIONS
E2
A
http://onsemi.com
CASE 485G-01
C
16 PIN QFN
SEATING
PLANE
ISSUE C
NBSG11
13
*For additional information on our Pb-Free strategy and solder
details, please download the ON Semiconductor Soldering a
Mounting Techniques Reference Manual, SOLDERRM/D.
0.575
0.022
0.128
3.25
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. L
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
0.012
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
MINIMUM SPACING BETWEEN LEAD TIP
AND FLAG
0.30
DIM
A1
A3
D2
E2
max
A
D
E
K
b
e
L
0.128
3.25
CONDITION CAN NOT VIOLATE 0.2 MM
MILLIMETERS
0.80
0.00
0.18
1.65
1.65
0.30
MIN
0.20 REF
3.00 BSC
3.00 BSC
0.50 BSC
0.18 TYP
MAX
1.00
0.05
0.30
1.85
1.85
0.50
0.50
0.02
SCALE 10:1
EXPOSED PAD
0.059
1.50
NBSG11/D
0.012
0.30
inches
mm