MC10H641FNG ON Semiconductor, MC10H641FNG Datasheet - Page 9
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MC10H641FNG
Manufacturer Part Number
MC10H641FNG
Description
IC CLOCK DRV 1:9 PECL-TTL 28PLCC
Manufacturer
ON Semiconductor
Type
Fanout Buffer (Distribution)r
Datasheet
1.MC100H641FNR2G.pdf
(10 pages)
Specifications of MC10H641FNG
Number Of Circuits
1
Ratio - Input:output
1:9
Differential - Input:output
Yes/Yes
Input
PECL
Output
TTL
Frequency - Max
65MHz
Voltage - Supply
4.75 V ~ 5.25 V
Operating Temperature
0°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-PLCC
Frequency-max
65MHz
Logic Type
Latched Translator
Logic Family
ECL
Translation
PECL to TTL
Propagation Delay Time
6.27 ns
Supply Voltage (max)
5.25 V
Supply Voltage (min)
4.75 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Logical Function
Latched Translator
Technology
ECL
High Level Output Current
-15mA
Low Level Output Current
24mA
Operating Supply Voltage (typ)
5V
Package Type
PLCC
Operating Supply Voltage (max)
5.25V
Operating Supply Voltage (min)
4.75V
Abs. Propagation Delay Time
7ns
Mounting
Surface Mount
Pin Count
28
Operating Temperature (min)
0C
Operating Temperature (max)
85C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC10H641FNG
Manufacturer:
ON Semiconductor
Quantity:
10 000
−L−
C
0.010 (0.250)
28
Z
G1
S
G
T
1
−N−
L−M
NOTES:
S
1. DATUMS −L−, −M−, AND −N− DETERMINED
2. DIMENSION G1, TRUE POSITION TO BE
3. DIMENSIONS R AND U DO NOT INCLUDE
4. DIMENSIONING AND TOLERANCING PER
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
7. DIMENSION H DOES NOT INCLUDE DAMBAR
V
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
MEASURED AT DATUM −T−, SEATING PLANE.
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
ANSI Y14.5M, 1982.
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
N
A
R
S
J
E
−M−
W
VIEW S
0.007 (0.180)
Y BRK
0.007 (0.180)
D
D
PACKAGE DIMENSIONS
PLASTIC PLCC PACKAGE
−T−
0.004 (0.100)
http://onsemi.com
SEATING
PLANE
CASE 776−02
M
M
FN SUFFIX
PLCC−28
ISSUE E
T
T
L−M
L−M
9
S
S
B
Z
N
N
DIM
G1
K1
W
A
B
C
G
H
K
R
U
E
F
J
V
X
Y
Z
S
VIEW D−D
S
U
X
0.485
0.485
0.165
0.090
0.013
0.026
0.020
0.025
0.450
0.450
0.042
0.042
0.042
0.410
0.040
0.007 (0.180)
MIN
−−−
K
0.050 BSC
2
INCHES
_
0.007 (0.180)
0.495
0.495
0.180
0.019
0.032
0.456
0.456
0.048
0.048
0.056
0.020
0.430
0.110
MAX
VIEW S
−−−
−−−
10
−−−
_
H
12.32
12.32
10.42
M
11.43
11.43
MILLIMETERS
MIN
4.20
2.29
0.33
0.66
0.51
0.64
1.07
1.07
1.07
1.02
−−−
1.27 BSC
2
G1
_
T
F
M
L−M
12.57
12.57
11.58
11.58
10.92
MAX
4.57
2.79
0.48
0.81
1.21
1.21
1.42
0.50
−−−
−−−
10
−−−
0.007 (0.180)
T
K1
_
0.010 (0.250)
S
0.007 (0.180)
L−M
N
S
S
N
M
S
S
M
T
T
T
L−M
L−M
L−M
S
S
S
N
N
N
S
S
S