FI212C249566-T Taiyo Yuden, FI212C249566-T Datasheet - Page 13

• Manufacturer Part Number: FI212C249566-T
• Description: FILTER BALANCE 2.5GHZ SMD WIMAX
• Manufacturer: Taiyo Yuden
• Series: FIr

Specifications of FI212C249566-T

• Frequency: 2.495GHz Center
• Bandwidth: 390MHz
• Filter Type: Balance
• Ripple: 1.2dB
• Insertion Loss: 2.9dB
• Package / Case: 0805 (2012 Metric)
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 587-2223-2

1. Operating Temperature Range
2. Storage Temperature Range
3. Resistance to Flexure of
4. Adhesion of Electrode
5. Solderability
6. Resistance to Solder Heat
7. Thermal Shock
8. Humidity （steady state）
9. High temperature life test
10. Low temperature life test
Note on standard condition: "standard condition" referred to herein is defined as follows 5 to 35℃ of temperature, 45 to 85％ relative
humidity and 86 to 106kPa of air pressure.
When there are questions concerning measurement result: In order to provide correlation data, the test shall be conducted under
condition of 20±2℃ of temperature, 60 to 70％ relative humidity and 86 to 106kPa of air pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition".
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RELIABILITY DATA
Substrate
当社カタログをご使用の際には 「当社製品に関するお断り」 を必ずお読みください。
Item
ー30∼＋85℃
ー30∼＋85℃
No mechanical damage.
Characteristics: shall satisfy the electrical characteristics.
Appearance: No significant abnormality.
75％ or more of immersed surface of terminal electrode shall be
covered with fresh solder.
Characteristics: shall satisfy the electrical characteristics.
Appearance: No significant abnormality.
Characteristics: shall satisfy the electrical characteristics.
Appearance: No significant abnormality.
Characteristics: shall satisfy the electrical characteristics.
Appearance: No significant abnormality.
Characteristics: shall satisfy the electrical characteristics.
Appearance: No significant abnormality.
Characteristics: shall satisfy the electrical characteristics.
Appearance: No significant abnormality.
Specified Value
※Note：ー20 to +35℃ in taped packaging
Warp：2mm
Testing board：Glass epoxy-resin substrate
Thickness：0.8mm
Applied force：5N
Duration：10 sec.
Solder temperature：230±5℃
Duration：4±1sec
Preconditioning：Immersion into flux.
Immersion and Removal speed：25 mm/sec.
Preheating：150℃ for 2 min.
Solder temperature：260±5℃
Duration：5±0.5sec.
Preconditioning：Immersion into flux.
Immersion and Removal speed：25 mm/sec.
Conditions for 1 cycle
Number of cycles：100
Mounting method：Soldering onto PC board.
Temperature：＋40±2℃
Humidity：90 to 95％RH
Duration：96 hrs
Temperature: ＋85±2℃
Duration: 96 hrs
Temperature: ー40±2℃
Duration: 96 hrs
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber
According to JIS C 0025.
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Recovery：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.
Step
1
2
3
4
Room Temperature
Room Temperature
Temperature （
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ー 40
Please read the "Notice for TAIYO YUDEN products" before using this catalog.
85
±
Test Methods and Remarks
±
2
℃
3
R-230
℃
℃
）
Duration （min）
Within 3
Within 3
30
30
±
±
3
3
437
6