NUF6406MNT1G ON Semiconductor, NUF6406MNT1G Datasheet - Page 6

IC FILTER 6CH EMI ESD PROT 12DFN

NUF6406MNT1G

Manufacturer Part Number
NUF6406MNT1G
Description
IC FILTER 6CH EMI ESD PROT 12DFN
Manufacturer
ON Semiconductor
Datasheet

Specifications of NUF6406MNT1G

Resistance (ohms)
100
Capacitance
13pF
Package / Case
12-TDFN Exposed Pad
Resistance In Ohms
100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power (watts)
-
Tolerance
-
Other names
NUF6406MNT1G
NUF6406MNT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NUF6406MNT1G
Manufacturer:
ON Semiconductor
Quantity:
280
Part Number:
NUF6406MNT1G
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
2 X
12 X
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
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REFERENCE
0.15 C
12X
PIN ONE
0.10 C
0.08 C
DETAIL A
12X
L
A
B
E
K
12
1
BOTTOM VIEW
SIDE VIEW
TOP VIEW
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D2
D
e
7
6
2 X
A1
12X
(A3)
0.15 C
E2
b
EXPOSED PAD
0.10
0.05
A
EXPOSED Cu
0.2 X 0.25 MM
NOTE 5
C
C
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
C
2X
NOTE 3
A
DFN12 3.0x1.35, 0.5P
SEATING
PLANE
(A3)
B
http://onsemi.com
CASE 506AD−01
ISSUE J
L1
6
CONSTRUCTION
DETAIL A
OPTIONAL
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
EDGE OF PACKAGE
0.500
0.020
Pitch
0.265
0.010
L
0.199
0.008
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. EXPOSED PADS CONNECTED TO DIE FLAG.
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL.
PAD AS WELL AS THE TERMINALS.
USED AS TEST CONTACTS.
DIM
A1
A3
D2
E2
L1
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
A
b
D
E
e
K
L
MILLIMETERS
MIN
0.80
0.00
0.18
2.10
0.20
0.20
0.20
0.00
3.00 BSC
1.35 BSC
0.50 BSC
0.20 REF
0.479
0.019
MAX
1.00
0.05
0.30
2.30
0.40
0.40
0.15
−−−
SCALE 16:1
0.351
0.014
NUF6406MN/D
2.352
0.093
inches
mm

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