LTC6992CS6-1#PBF Linear Technology, LTC6992CS6-1#PBF Datasheet - Page 30

• Manufacturer Part Number: LTC6992CS6-1#PBF
• Manufacturer: Linear Technology

Specifications of LTC6992CS6-1#PBF

• Lead Free Status / RoHS Status: Compliant

LTC6992-1/LTC6992-2/
LTC6992-3/LTC6992-4
PACKAGE DESCRIPTION
30
3.55 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
1.65 ±0.05
(2 SIDES)
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
2.00 ±0.10
1.35 ±0.05
(2 SIDES)
(2 SIDES)
(Reference LTC DWG # 05-08-1715 Rev A)
6-Lead Plastic DFN (2mm × 3mm)
0.50 BSC
0.75 ±0.05
0.25 ± 0.05
DCB Package
0.70 ±0.05
3.00 ±0.10
(2 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
R = 0.05
(2 SIDES)
TYP
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
1.35 ±0.10
(2 SIDES)
3
4
6
1
0.50 BSC
0.40 ± 0.10
0.25 ± 0.05
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
(DCB6) DFN 0405
69921234f