LFXP15C-3FN256C LATTICE SEMICONDUCTOR, LFXP15C-3FN256C Datasheet - Page 115
LFXP15C-3FN256C
Manufacturer Part Number
LFXP15C-3FN256C
Description
FPGA LatticeXP Family 15000 Cells 320MHz 130nm (CMOS) Technology 1.8V/2.5V/3.3V 256-Pin FBGA Tray
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet
1.LFXP3C-3QN208C.pdf
(130 pages)
Specifications of LFXP15C-3FN256C
Package
256FBGA
Family Name
LatticeXP
Device Logic Units
15000
Maximum Internal Frequency
320 MHz
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Maximum Number Of User I/os
188
Ram Bits
331776
Re-programmability Support
Yes
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFXP15C-3FN256C
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
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Pinout Information
Lattice Semiconductor
LatticeXP Family Data Sheet
Thermal Management
Thermal management is recommended as part of any sound FPGA design methodology. To assess the thermal
characteristics of a system, Lattice specifies a maximum allowable junction temperature in all device data sheets.
Designers must complete a thermal analysis of their specific design to ensure that the device and package do not
exceed the junction temperature limits. Refer to the Thermal Management document to find the device/package
specific thermal values.
For Further Information
For further information regarding Thermal Management, refer to the following located on the Lattice website at
www.latticesemi.com.
• Thermal Management document
• Technical Note TN1052 - Power Estimation and Management for LatticeECP/EC and LatticeXP Devices
• Power Calculator tool included with Lattice’s ispLEVER design tool, or as a standalone download from
www.latticesemi.com/software
4-56
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