XC3SD3400A-5FGG676C Xilinx Inc, XC3SD3400A-5FGG676C Datasheet - Page 101

• Manufacturer Part Number: XC3SD3400A-5FGG676C
• Description: FPGA Spartan®-3A Family 3.4M Gates 53712 Cells 770MHz 90nm Technology 1.2V 676-Pin FBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3A DSPr

Specifications of XC3SD3400A-5FGG676C

• Package: 676FBGA
• Family Name: Spartan®-3A
• Device Logic Units: 53712
• Device System Gates: 3400000
• Maximum Internal Frequency: 770 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 469
• Ram Bits: 2322432
• Number Of Logic Elements/cells: 53712
• Number Of Labs/clbs: 5968
• Total Ram Bits: 2322432
• Number Of I /o: 469
• Number Of Gates: 3400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 676-BBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 122-1532 - KIT DEVELOPMENT SPARTAN 3ADSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Revision History
The following table shows the revision history for this document.
DS610 (v3.0) October 4, 2010
Product Specification
04/02/07
05/25/07
06/18/07
07/16/07
06/02/08
03/11/09
10/04/10
Date
Version
1.0
1.1
1.2
2.0
2.1
2.2
3.0
Initial Xilinx release.
Updates to
VREF pins in XC3S1800A FG676
FPGA
Updated for Production release.
Added Low-power options. Added advance thermal data to
Added
AB14 in CS484 in
Corrected bank designation for SUSPEND to VCCAUX.
Revision update to match other data sheet modules.
(Figure
Package Overview
Table
16) and XC3SD3400A FPGA
59,
Table
Table
63. Updated links.
www.xilinx.com
section. Updated Thermal Characteristics in
63,
Table
(Table
64,
Table
Spartan-3A DSP FPGA Family: Pinout Descriptions
70). Updated FG676 package footprints for XC3SD1800A
(Figure
Revision
65,
Table
17). Minor edits.
66,
Table
Table
62.
67,
Table
Table
68,
62. Corrected name for
Table
69. Corrected
101