JD54F194BFA National Semiconductor, JD54F194BFA Datasheet - Page 5
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JD54F194BFA
Manufacturer Part Number
JD54F194BFA
Description
Manufacturer
National Semiconductor
Datasheet
1.JD54F194BFA.pdf
(8 pages)
Specifications of JD54F194BFA
Lead Free Status / RoHS Status
Not Compliant
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
Physical Dimensions
Temperature Range Family
Device Type
Package Code
74F
54F
SJ
D
P
S
F
L
e
e
e
e
e
e
e
e
Commercial
Military
Plastic DIP
Ceramic DIP
Flatpak
Leadless Chip Carrier (LCC)
Small Outline SOIC JEDEC
Small Outline SOIC EIAJ
inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
74F
194
5
S
C
X
Special Variations
Temperature Range
QB
C
M
X
e
e
e
e
Commercial (0 C to
Military (
Military grade device with
Devices shipped in 13 reel
environmental and burn-in
processing
b
55 C to
a
a
125 C)
70 C)