MC9S08QE128CLH Freescale, MC9S08QE128CLH Datasheet - Page 13

• Manufacturer Part Number: MC9S08QE128CLH
• Manufacturer: Freescale

Specifications of MC9S08QE128CLH

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 50.33MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 8KB
• # I/os (max): 54
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 22-chx12-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 128KB
• Lead Free Status / RoHS Status: Compliant

3.4
This section provides information about operating temperature range, power dissipation, and package thermal resistance. Power
dissipation on I/O pins is usually small compared to the power dissipation in on-chip logic and voltage regulator circuits, and
it is user-determined rather than being controlled by the MCU design. To take P
the difference between actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
Freescale Semiconductor
T
θ
P
P
P
JA
A
D
int
I/O
Thermal Characteristics
= Ambient temperature, °C
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
3
int
DD
Power supply must maintain regulation within operating V
operating maximum current conditions. If positive injection current (V
I
out of regulation. Ensure external V
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if
no system clock is present, or if the clock rate is very low (which would reduce overall power
consumption).
DD
+ P
× V
, the injection current may flow out of V
I/O
DD
Operating temperature range (packaged)
Maximum junction temperature
Thermal resistance
Thermal resistance
, Watts — chip internal power
Single-layer board
Four-layer board
32-pin LQFP
44-pin LQFP
48-pin QFN
64-pin LQFP
80-pin LQFP
32-pin LQFP
44-pin LQFP
48-pin QFN
64-pin LQFP
80-pin LQFP
MC9S08QE128 Series Data Sheet, Rev. 7
J
) in °C can be obtained from:
Rating
Table 5. Thermal Characteristics
SS
T
J
or V
= T
DD
A
DD
load will shunt current greater than maximum injection
+ (P
and multiply by the pin current for each I/O pin. Except in cases of
DD
D
and could result in external power supply going
× θ
JA
)
Symbol
T
θ
θ
θ
θ
T
JM
JA
JA
JA
JA
DD
A
range during instantaneous and
I/O
into account in power calculations, determine
–40 to 85
SS
Value
95
82
68
81
69
60
54
46
26
50
47
or V
In
> V
DD
DD
will be very small.
) is greater than
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
Electrical Characteristics
Eqn. 1
13