GNM314R71H332MD01D Murata, GNM314R71H332MD01D Datasheet - Page 156
![](/photos/30/39/303941/c5750_sml.jpg)
GNM314R71H332MD01D
Manufacturer Part Number
GNM314R71H332MD01D
Description
Manufacturer
Murata
Type
Ceramicr
Datasheet
1.GNM314R71H332MD01D.pdf
(220 pages)
Specifications of GNM314R71H332MD01D
Capacitance
3300pF
No. Of Capacitors
4
Tolerance (+ Or -)
20%
Voltage
50VDC
Number Of Terminals
8Terminal
Temp Coeff (dielectric)
X7R
Operating Temp Range
-55C to 125C
Mounting Style
Surface Mount
Package / Case
1206
Construction
SMT Chip
Failure Rate
Not Required
Product Height (mm)
0.8mm
Product Depth (mm)
1.6mm
Product Length (mm)
3.2mm
Lead Diameter (nom)
Not Requiredmm
Terminal Pitch
0.8mm
Lead Free Status / RoHS Status
Compliant
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
2. Land Dimensions
Table 1 Flow Soldering Method
Table 2 Reflow Soldering Method
154
Notice
Notice
Part Number
Part Number
2-1. Chip capacitor can be cracked due to the stress of
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
PCB bending / etc if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1 for flow
soldering, table 2 for reflow soldering, table 3 for
GNM & LLA, and table 4 for LLM.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
GRM18
GQM18
GRM21
GQM21
GRM31
GRM02
GRM03
GRM15
GRM18
GQM18
GRM21
GQM21
GRM31
GRM32
GRM43
GRM55
ERF1D
GJM03
GJM15
ERF1D
ERB11
ERB21
ERB11
ERB21
ERB32
ERF22
LLL21
LLL31
LLL15
LLL18
LLL21
LLL31
Dimensions
Dimensions
Chip (LgW)
Chip (LgW)
2.0g1.25
1.25g2.0
1.25g1.0
2.0g1.25
2.0g1.25
1.25g2.0
1.25g1.0
2.0g1.25
0.4g0.2
1.6g0.8
3.2g1.6
1.6g3.2
1.4g1.4
0.6g0.3
1.0g0.5
1.6g0.8
3.2g1.6
3.2g2.5
4.5g3.2
5.7g5.0
0.5g1.0
0.8g1.6
1.6g3.2
3.2g2.5
1.4g1.4
2.8g2.8
0.16 to 0.2
0.15 to 0.2
0.6 to 1.0
1.0 to 1.2
2.2 to 2.6
0.4 to 0.7
0.6 to 1.0
0.4 to 0.6
1.0 to 1.2
0.5 to 0.8
0.2 to 0.3
0.3 to 0.5
0.6 to 0.8
1.0 to 1.2
2.2 to 2.4
2.0 to 2.4
3.0 to 3.5
4.0 to 4.6
0.2 to 0.3
0.4 to 0.6
0.6 to 0.8
0.4 to 0.6
1.0 to 1.2
2.2 to 2.5
0.4 to 0.8
1.8 to 2.1
a
a
0.12 to 0.18
0.35 to 0.45
0.2 to 0.35
0.2 to 0.25
c
0.8 to 0.9
0.9 to 1.0
1.0 to 1.1
0.5 to 0.7
0.8 to 0.9
0.6 to 0.8
0.9 to 1.0
0.8 to 0.9
0.6 to 0.7
0.6 to 0.7
0.8 to 0.9
1.0 to 1.2
1.2 to 1.4
1.4 to 1.6
0.3 to 0.4
0.4 to 0.5
0.6 to 0.7
0.6 to 0.8
0.6 to 0.8
0.8 to 1.0
0.6 to 0.8
0.7 to 0.9
b
Chip Capacitor
b
b
a
Continued on the following page.
Solder Resist
Land
0.2 to 0.23
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.4 to 1.8
2.6 to 2.8
0.8 to 1.0
0.8 to 1.0
1.0 to 1.2
0.2 to 0.4
0.4 to 0.6
0.6 to 0.8
0.8 to 1.1
1.0 to 1.4
1.8 to 2.3
2.3 to 3.0
3.5 to 4.8
0.7 to 1.0
1.4 to 1.6
1.4 to 1.8
2.6 to 2.8
0.8 to 1.0
0.8 to 1.0
1.9 to 2.3
1.0 to 1.2
2.2 to 2.6
c
c
(in mm)
(in mm)
C02E.pdf
09.9.18
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