DS1388Z-33 Maxim Integrated Products, DS1388Z-33 Datasheet - Page 2
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DS1388Z-33
Manufacturer Part Number
DS1388Z-33
Description
Real Time Clock
Manufacturer
Maxim Integrated Products
Datasheet
1.DS1388Z-33.pdf
(19 pages)
Specifications of DS1388Z-33
Rtc Memory Size
512 B
Supply Voltage (max)
3.63 V
Supply Voltage (min)
2.97 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Rtc Bus Interface
I2C
Supply Current
250 uA
Package / Case
SOIC-8
Time Format
HH:MM:SS:hh
Date Format
YY-MM-DD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DS1388Z-33
Manufacturer:
MAX
Quantity:
20 000
Company:
Part Number:
DS1388Z-33+
Manufacturer:
Maxim
Quantity:
7 784
Company:
Part Number:
DS1388Z-33+T&R
Manufacturer:
MAXIM
Quantity:
13 000
ABSOLUTE MAXIMUM RATINGS
Voltage Range on V
Voltage Range on Inputs Relative
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
I
and 512 Bytes EEPROM
RECOMMENDED DC OPERATING CONDITIONS
(T
DC ELECTRICAL CHARACTERISTICS
(V
Note 1:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
2
Supply Voltage
Logic 1
Logic 0
Pullup Voltage (SCL, SDA),
V
V
Power-Fail Voltage
Trickle-Charger Current-Limiting
Resistors
Input Leakage (SCL)
I/O Leakage (SDA)
I/O Leakage (RST)
SDA Logic 0 Output
(V
2
A
CC
BACKUP
CC
to Ground ...............................................-0.3V to (V
OL
= -40°C to +85°C, unless otherwise noted.) (Note 2)
C RTC/Supervisor with Trickle Charger
_____________________________________________________________________
= 0V
= V
= 0.15 x V
CC(MIN)
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Voltage
PARAMETER
PARAMETER
CC
to V
)
CC
CC(MAX)
Pin Relative to Ground .....-0.3V to +6.0V
, T
A
= -40°C to +85°C, unless otherwise noted.) (Note 2)
SYMBOL
V
SYMBOL
BACKUP
I
JC
OLDOUT
I
V
V
V
V
LORST
V
CC
PU
JA
PF
I
IH
R1
R2
R3
) (Note 1) ......40°C/W
IL
I
LO
LI
) (Note 1)..170°C/W
(Note 3)
(Note 3)
(Note 3)
(Note 3)
(Note 3)
(Notes 4, 5)
(Note 6)
(Note 7)
(Note 8)
CC
+ 0.3V)
CONDITIONS
CONDITIONS
Operating Temperature Range
Storage Temperature Range .............................-55°C to +125°C
Lead Temperature (soldering, 10s) .................................+260°C
Soldering Temperature (reflow) .......................................+260°C
(noncondensing) .............................................-40°C to +85°C
DS1388Z-5
DS1388Z-33
DS1388Z-3
DS1388Z-5
DS1388Z-33
DS1388Z-3
0.7 x
-200
MIN
2.97
4.15
2.70
2.45
MIN
V
-0.3
4.5
2.7
1.3
-1
-1
CC
2000
4000
TYP
TYP
4.33
2.88
2.60
250
3.3
3.0
5
3
+0.3 x
V
MAX
MAX
3.63
4.50
2.97
2.70
+10
V
5.5
3.3
CC
0.3
5.5
5.5
+1
+1
3
CC
+
UNITS
UNITS
mA
μA
μA
μA
V
V
V
V
V
V