MMBF5457LT ON Semiconductor, MMBF5457LT Datasheet - Page 5

• Manufacturer Part Number: MMBF5457LT
• Manufacturer: ON Semiconductor

Specifications of MMBF5457LT

• Lead Free Status / RoHS Status: Not Compliant

b
1
e
D
3
2
A1
E
H
A
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
SOT−23 (TO−236)
http://onsemi.com
MMBF5457LT1
CASE 318−08
C
ISSUE AL
5
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
STYLE 10:
PIN 1. DRAIN
DIM
0.037
A1
H
A
b
c
D
E
e
0.95
L
E
2. SOURCE
3. GATE
0.079
inches
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.35
2.10
MIN
2.0
mm
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.54
2.40
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.014
0.083
MIN
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.021
0.094
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.029
0.104
MAX