MMBF5457L ON Semiconductor, MMBF5457L Datasheet - Page 5
MMBF5457L
Manufacturer Part Number
MMBF5457L
Description
Manufacturer
ON Semiconductor
Datasheet
1.MMBF5457L.pdf
(6 pages)
Specifications of MMBF5457L
Channel Type
N
Configuration
Single
Gate-source Voltage (max)
25V
Drain-gate Voltage (max)
25V
Drain-source Volt (max)
25V
Operating Temperature (min)
-55C
Operating Temperature (max)
150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Package Type
SOT-23
Lead Free Status / RoHS Status
Not Compliant
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Company
Part Number
Manufacturer
Quantity
Price
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Part Number:
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Manufacturer:
NSC
Quantity:
6 625
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Part Number:
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b
1
e
D
3
2
A1
E
H
A
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
L
0.037
0.95
0.035
0.9
0.031
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
0.8
SOT−23 (TO−236)
http://onsemi.com
MMBF5457LT1
CASE 318−08
C
ISSUE AL
5
SCALE 10:1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
STYLE 10:
PIN 1. DRAIN
DIM
0.037
A1
H
A
b
c
D
E
e
0.95
L
E
2. SOURCE
3. GATE
0.079
inches
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.35
2.10
MIN
2.0
mm
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.54
2.40
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.014
0.083
MIN
INCHES
NOM
0.040
0.002
0.018
0.005
0.114
0.051
0.075
0.021
0.094
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.029
0.104
MAX