LV2205 ON Semiconductor, LV2205 Datasheet
LV2205
Specifications of LV2205
Available stocks
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LV2205 Summary of contents
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... Value Unit Vdc I F 200 mAdc 225 mW/ C 1.8 280 2 +150 C T stg –55 to +150 C MV2109 = MV2109 LV2205 = LV2205 LV2209 = LV2209 ( unless otherwise noted) Min Typ Max Unit Vdc 30 – – 25 – – – – 0.1 Adc – 280 – ppm http://onsemi ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 Device Min MMBV2101LT1/MV2101 6.1 MMBV2103LT1 9.0 LV2205/MMBV2105LT1/MV2105 13.5 MMBV2107LT1 19.8 MMBV2108LT1 24.3 LV2209MMBV2109LT1/MV2109 29.7 MMBV2101LT1, MMBV2103LT1, MMBV2105LT1, MMBV2107LT1 thru MMBV2109LT1, are also available in bulk. Use the device title and drop the ”T1” suffix when ordering any of these devices in bulk. ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 TYPICAL DEVICE CHARACTERISTICS Figure 1. Diode Capacitance versus Reverse Voltage Figure 2. Normalized Diode Capacitance versus Junction Temperature Figure 4. Figure of Merit versus Reverse Voltage Figure 3. Reverse Current versus Reverse Bias Figure 5. Figure of Merit versus Frequency http://onsemi.com ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection The power dissipation of the SOT– ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches. ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 PACKAGE DIMENSIONS SOT–23 (TO–236AB http://onsemi.com CASE 318–08 ISSUE ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 PACKAGE DIMENSIONS TO–92 (TO–226AC CASE 182–06 ISSUE L D É É J É É SECTION X–X http://onsemi.com 7 ...
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... MMBV2101LT1 Series, MV2105, MV2101, MV2109, LV2205, LV2209 Thermal Clad is a trademark of the Bergquist Company. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...