BAP51-02 NXP Semiconductors, BAP51-02 Datasheet - Page 4

• Manufacturer Part Number: BAP51-02
• Description: General purpose PIN diode in a SOD523 ultra small SMD plastic package
• Manufacturer: NXP Semiconductors

Specifications of BAP51-02

• Configuration: Single
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 715mW
• Operating Temperature Classification: Military
• Package Type: I-IGIA
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 9@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 2.5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
PACKAGE OUTLINE
Plastic surface-mounted package; 2 leads
General purpose PIN diode
OUTLINE
VERSION
SOD523
A
E
b p
c
1
(1)
IEC
H E
D
JEDEC
2
REFERENCES
A
Rev. 03 - 2 January 2008
v
M
SC-79
JEITA
A
DIMENSIONS (mm are the original dimensions)
Note
1. The marking bar indicates the cathode.
UNIT
mm
0.65
0.58
A
0.34
0.26
b p
0
0.17
0.11
PROJECTION
EUROPEAN
c
scale
0.5
1.25
1.15
D
1 mm
0.85
0.75
Product specification
E
BAP51-02
ISSUE DATE
02-12-13
06-03-16
1.65
1.55
H E
SOD523
4 of 6
0.1
v