BAP51-05W NXP Semiconductors, BAP51-05W Datasheet - Page 2

• Manufacturer Part Number: BAP51-05W
• Description: Two planar PIN diodes in common cathode configuration in a SOT323 small SMD plastic package
• Manufacturer: NXP Semiconductors
• Type: Attenuatorr

Specifications of BAP51-05W

• Configuration: Dual Common Cathode
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Power Dissipation: 240mW
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Package Type: SC-70
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 9@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 2.5@10mAOhm
• Typical Carrier Life Time: 550ns
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 3
• Applications Frequency Range: VHF
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
FEATURES
 Two elements in common cathode configuration in a
 Low diode capacitance
 Low diode forward resistance.
APPLICATIONS
 General RF applications.
DESCRIPTION
Two planar PIN diodes in common cathode configuration
in a SOT323 small SMD plastic package.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2001 Jan 23
Per diode
V
I
P
T
T
SYMBOL
F
small SMD plastic package
stg
j
R
tot
General purpose PIN diode
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
PARAMETER
T
s
 90 C
2
PINNING
handbook, halfpage
CONDITIONS
Marking code: 1W-
Fig.1 Simplified outline (SOT323) and symbol.
1
Top view
PIN
1
2
3
3
2
anode (a1)
anode (a2)
common cathode



65
65
MIN.
MAM382
1
Product specification
DESCRIPTION
BAP51-05W
50
50
240
+150
+150
MAX.
3
V
mA
mW
C
C
UNIT
2