HSMP3822BLK Avago Technologies US Inc., HSMP3822BLK Datasheet
HSMP3822BLK
Specifications of HSMP3822BLK
Related parts for HSMP3822BLK
HSMP3822BLK Summary of contents
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HSMP-382x, 482x Surface Mount RF PIN Switch and Limiter Diodes Data Sheet Description/Applications The HSMP-382x series is optimized for switching ap- plications where ultra-low resistance is required. The HSMP-482x diode is ideal for limiting and low induc- tance switching applications up to 1.5 GHz. A SPICE ...
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Absolute Maximum Ratings T = +25°C [1] C Symbol Parameter I Forward Current (1 µs Pulse Peak Inverse Voltage IV T Junction Temperature j T Storage Temperature stg θ Thermal Resistance [2] jc Notes: 1. Operation in excess of any one of these conditions may result in permanent damage to the device +25°C, where T is defined to be the temperature at the package pins where contact is ...
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Typical Parameters 25°C (unless otherwise noted), Single Diode C 100 10 1 0.1 –50C 125C 25C 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 V – FORWARD VOLTAGE (mA) F Figure 1. Forward Current vs. Forward Voltage. ...
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Typical Applications for Multiple Diode Products, RF COMMON RF 1 Figure 9. Switch Using Both Positive and Negative Bias Current. BIAS Figure 11. High Isolation SPST Switch (Repeat Cells as Required. Figure 11. High Isolation SPST Switch (Repeat Cells as ...
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Typical Applications for HSMP-482x Low Inductance Series Microstrip Series Connection for HSMP-482x Series In order to take full advantage of the low inductance of the HSMP-482x series when using them in series applications, both lead 1 and lead 2 should be connected together, as shown in Figure 14 HSMP-482x Figure 13. ...
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Assembly Information SOT-323 PCB Footprint A recommended PCB pad layout for the miniature SOT- 323 (SC-70) package is shown in Figure 19 (dimensions are in inches). This layout provides ample allowance for package placement by automated assembly equipment without adding parasitics that could impair the performance. 0.026 0.079 0.039 0.022 Dimensions in inches Figure 19. Recommended PCB Pad Layout for Avago’s ...
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SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, type of solder alloy, and the thermal conductivity and thermal mass of components. Components with a low mass, such as the SOT-323/-23 package, will ...
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Package Dimensions Outline 23 (SOT-23 XXX SYMBOL Notes: e2 XXX-package marking E Drawings are not to scale L Package Characteristics Lead Material ....................................................... Copper (SOT-323); Alloy 42 (SOT-23) Lead Finish ............................................................................ ...
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Device Orientation For Outlines SOT-23/323 REEL CARRIER TAPE USER FEED DIRECTION COVER TAPE Tape Dimensions and Product Orientation For Outline SOT- 9° MAX A 0 DESCRIPTION SYMBOL CAVITY LENGTH WIDTH DEPTH PITCH BOTTOM HOLE DIAMETER PERFORATION ...
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Tape Dimensions and Product Orientation For Outline SOT-323 DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION DIAMETER D PITCH P ...