BAP50LX NXP Semiconductors, BAP50LX Datasheet - Page 2

• Manufacturer Part Number: BAP50LX
• Description: General purpose PIN diode in a SOD882T leadless ultra small plastic SMD package
• Manufacturer: NXP Semiconductors

Specifications of BAP50LX

• Configuration: Single
• Forward Current: 50mA
• Forward Voltage: 1.1V
• Operating Temperature Classification: Military
• Reverse Voltage: 50V
• Mounting: Surface Mount
• Maximum Series Resistance @ Minimum If: 40@0.5mAOhm
• Maximum Series Resistance @ Maximum If: 5@10mAOhm
• Operating Temperature (max): 150C
• Operating Temperature (min): -65C
• Pin Count: 2
• Applications Frequency Range: SHF
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
4. Marking
5. Limiting values
6. Thermal characteristics
7. Characteristics
Table 6.
T
BAP50LX_1
Product data sheet
Symbol
V
V
I
C
r
ISL
R
D
amb
F
R
d
= 25 C unless otherwise specified.
Characteristics
Parameter
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
isolation
Table 3.
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
Table 5.
Type number
BAP50LX
Symbol
V
I
P
T
T
Symbol
R
F
stg
j
R
tot
th(j-sp)
Marking
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction
to solder point
Parameter
reverse voltage
forward current
total power dissipation
storage temperature
junction temperature
Conditions
I
I
V
see
see
see
F
R
R
= 50 mA
V
V
V
I
I
I
f = 900 MHz
f = 1800 MHz
f = 2450 MHz
= 10 A
F
F
F
= 50 V
R
R
R
Figure
Figure
Figure
= 0.5 mA
= 1 mA
= 10 mA
= 0 V
= 1 V
= 5 V
Rev. 01 — 17 July 2007
1; f = 1 MHz;
2; f = 100 MHz;
3; V
R
= 0 V;
Conditions
continuous
continuous
T
sp
= 90 C
Conditions
Marking code
LB
Min
-
50
-
-
-
-
-
-
-
-
-
-
Min
-
-
-
65
65
Typ
0.95
-
-
0.40
0.28
0.19
26
14
3
20.3
17.9
16.5
BAP50LX
Max
50
50
150
+150
+150
Typ
53
© NXP B.V. 2007. All rights reserved.
Silicon PIN diode
Max
1.1
-
100
-
0.55
0.35
40
25
5
-
-
-
Unit
V
mA
mW
Unit
K/W
C
C
Unit
V
V
nA
pF
pF
pF
dB
dB
dB
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