MT9V135L12STCES Micron Technology Inc, MT9V135L12STCES Datasheet - Page 16

• Manufacturer Part Number: MT9V135L12STCES
• Manufacturer: Micron Technology Inc

Specifications of MT9V135L12STCES

• Lead Free Status / RoHS Status: Compliant

Package Diagram
Figure 10:
PDF: 09005aef82c99cd/Source:09005aef824c99db
MT9V135_LDS_3.fm - Rev. B 3/07 EN
Micron, the M logo, the Micron logo, and DigitalClarity are trademarks of Micron Technology, Inc. All other trademarks are
Preliminary: This data sheet contains initial characterization limits that are subject to change upon full characterization of
0.40 ±0.05
Seating
8.8
4X
plane
1.0 ±0.2
48X
47X
4.4
0.2
D
A
48-Pin CLCC Package Outline Drawing
over Ni plating, 1.27 microns
Notes:
5.215
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Au plating, 0.50 microns
4.4
minimum thickness
minimum thickness
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
11.43
48
8.8
1. Optical center = package center.
2. All dimensions are in millimeters.
1
Lead finish:
TYP
0.8
5.715
the property of their respective owners.
0.8 TYP
1.7
B
1.75
5.715
4.84
48X R 0.15
5.215
production devices.
for reference only
for reference only
1.400 ±0.125
2.3 ±0.2
11.43
C
16
A
0.90
0.35
0.05
MT9V135: SOC VGA Digital Image Sensor
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
Lid material: borosilicate glass 0.55 thickness
Image
sensor die:
0.675 thickness
0.10 A
Ø0.20 A B C
V CTR
Optical
Optical area:
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to
Maximum tilt of optical area relative to
area
seating plane A : 50 microns
top of cover glass D : 100 microns
Ø0.20 A B C
10.9 ±0.1
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H CTR
CTR
Package Diagram
Preliminary
Optical
center
10.9 ±0.1
First
clear
pixel
CTR
1