UPD8827ACZ-A Renesas Electronics America, UPD8827ACZ-A Datasheet - Page 22

• Manufacturer Part Number: UPD8827ACZ-A
• Manufacturer: Renesas Electronics America

Specifications of UPD8827ACZ-A

• Lead Free Status / RoHS Status: Compliant

RECOMMENDED SOLDERING CONDITIONS
to consult with our sales offices.
Type of Through-hole Device
μ
Cautions 1. During assembly care should be taken to prevent solder or flux from contacting the glass cap.
NOTES OF HANDLING THE PACKAGES
come off internally. Particular care should be taken when mounting the package on the circuit board. You should not
reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB.
supports: 70 mm). Avoid imposing a load, however, on the inside portion as viewed from the face on which the window
(glass) is bonded to the package body.
Note
20
Partial heating method
PD8827ACZ-A: CCD linear image sensor 40-pin plastic DIP with heat sink (15.24 mm (600))
When soldering this product, it is highly recommended to observe the conditions as shown below.
If other soldering processes are used, or if the soldering is performed under different conditions, please make sure
The application of an excessive load to the package may cause the package to warp or break, or cause chips to
For this product, the reference value for the three-point bending strength
Three-point bending strength test Distance between supports: 70 mm, Support R: R2 mm, Loading rate: 0.5
mm/min.
Process
2. Soldering by the solder flow method may have deleterious effects on prevention of glass cap
The optical characteristics could be degraded by such contact.
soiling and heat resistance. So the method cannot be guaranteed.
Pin temperature: 380°C or below, Heat time: 3 seconds or less (per pin).
70 mm
Load
Data Sheet S17962EJ1V0DS
Conditions
Note
70 mm
is 280 [N] (at distance between
Load
μ
PD8827A